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MC100E131FNR2G

Onsemi

MC100E131FNR2G by Onsemi

MC100E131FNR2G by Onsemi is a 4-bit ECL latch with 0.675 ns propagation delay. Operating at -4.5 to 5 V, it has a max frequency of 1.1 GHz and trigger type as positive edge for high-speed applications in electronics.

Median Price

$7.410

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 341 parts In-Stock

1+ parts

-

100+ parts

$7.410

1k+ parts

$6.630

10k+ parts

$6.240

341

-

$7.410

$6.630

$6.240

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 509 parts In-Stock

1+ parts

$7.838

100+ parts

-

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509

$7.838

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-

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Vyrian

USA . 2,979 parts In-Stock

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2,979

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Freddi Giovanni

Italy . 240 parts In-Stock

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240

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 341 parts In-Stock

1+ parts

$7.010

100+ parts

-

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341

$7.010

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Corphita

USA . 967 parts In-Stock

1+ parts

$7.425

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-

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967

$7.425

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Corohmni

South Africa . 245 parts In-Stock

1+ parts

$8.250

100+ parts

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245

$8.250

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AZTECH Wire

Italy . 124 parts In-Stock

1+ parts

$21.400

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124

$21.400

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Microchip USA

USA . 2,339 parts In-Stock

1+ parts

$25.553

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2,339

$25.553

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Component Stockers USA

USA . 434 parts In-Stock

1+ parts

$99.990

100+ parts

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434

$99.990

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TANS Electronics

Latvia . 6,427 parts In-Stock

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6,427

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SupplyDigital Components

Austria . 3,738 parts In-Stock

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3,738

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UHIMA Technologies

Türkiye . 399 parts In-Stock

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399

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Problanco Electronics

Mexico . 357 parts In-Stock

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357

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Kulean Microsystems

USA . 288 parts In-Stock

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288

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Overview

Experience unparalleled speed and reliability with the MC100E131FNR2G by Onsemi. As a leader in the industry, Onsemi sets the standard for quality and innovation. This chip carrier latch and flip-flop offers a multitude of applications in various industries. With a nominal supply voltage of 5V and a maximum operating temperature of 85 °C, this product delivers exceptional performance. Trust Onsemi to provide you with cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the latch, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Propagation Delay (tpd): 0.675 ns

Offers fast response time, crucial for time-sensitive applications where quick switching is required.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for a wide range of operating environments.

Output Polarity: COMPLEMENTARY

Provides both inverted and non-inverted outputs, offering versatility in signal processing applications.

Technical Specifications

Latches & Flip-Flops MC100E131FNR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

1000000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

81 mA

Propagation Delay (tpd):

.675 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

11.505 mm

Minimum fmax:

1100 MHz

Trade Compliance

MC100E131FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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