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MAC218A8FP

Onsemi

MAC218A8FP by Onsemi

MAC218A8FP by Onsemi is a TRIAC with 600V repetitive peak off-state voltage, 8A max RMS on-state current, and 50mA max DC gate trigger current. It is ideal for applications requiring precise AC power control in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 2,198 parts In-Stock

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Semi Source

USA . 410 parts In-Stock

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Vyrian

USA . 112 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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Kulean Microsystems

USA . 4,525 parts In-Stock

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SupplyDigital Components

Austria . 3,466 parts In-Stock

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Problanco Electronics

Mexico . 1,987 parts In-Stock

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TANS Electronics

Latvia . 800 parts In-Stock

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800

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Corohmni

South Africa . 490 parts In-Stock

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Corphita

USA . 226 parts In-Stock

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Assy Fe

Spain . 100 parts In-Stock

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UHIMA Technologies

Türkiye . 19 parts In-Stock

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Overview

Experience peak performance and reliability with the MAC218A8FP by Onsemi, a trusted leader in semiconductor manufacturing. As a TRIAC device, this product offers seamless control over alternating current circuits, making it ideal for a wide range of applications. From lighting control to motor speed regulation, this high-quality component ensures efficient and precise operation. Trust in Onsemi's reputation for excellence and choose the MAC218A8FP for superior functionality and value. Elevate your projects with this top-tier solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and durability, making the product safe to use and long-lasting.

Maximum DC Gate Trigger Current: 50 mA

Allows for reliable and precise triggering of the device, ensuring smooth operation.

Configuration: SINGLE

Simplified design and installation process with only one TRIAC to work with.

Terminal Form: THROUGH-HOLE

Easy to solder onto a PCB for secure and stable connection.

Maximum Leakage Current: 2 mA

Low leakage current minimizes power loss and improves efficiency.

No. of Terminals: 3

Simple and straightforward connection setup with three terminals to work with.

Package Style (Meter): FLANGE MOUNT

Convenient mounting option for ease of installation and maintenance.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows the product to perform reliably in various conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Enables precise control over the TRIAC, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Can operate in low temperatures without compromising performance.

Terminal Finish: TIN LEAD

Provides a reliable and secure connection for the terminals, ensuring proper functionality.

Terminal Position: SINGLE

Simplified design with a single terminal position for easy installation.

Maximum RMS On-state Current: 8 A

High on-state current rating allows the product to handle heavier loads with ease.

Maximum DC Gate Trigger Voltage: 2 V

Low gate trigger voltage helps in efficient triggering of the device.

Case Connection: ISOLATED

Provides insulation and protection against electrical interference for secure operation.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage rating ensures reliable performance in a variety of applications.

Maximum Holding Current: 50 mA

High holding current ensures the device remains in the on-state even in adverse conditions.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC218A8FP attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

50 mA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC218A8FP Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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