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LC75897PW-E

Onsemi

LC75897PW-E by Onsemi

LC75897PW-E by Onsemi is a Graphics Display Driver with 128 segments, operating at -40 to 85 °C. It features a supply voltage of 2.7-6V and consumes 1.4mA max current. Ideal for Liquid Crystal Displays, this IC has a quad-terminal position in a square-shaped flatpack package.

Median Price

$4.730

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 575 parts In-Stock

1+ parts

-

100+ parts

$4.090

1k+ parts

$3.660

10k+ parts

$3.440

575

-

$4.090

$3.660

$3.440

DigiKey

USA . 575 parts In-Stock

1+ parts

-

100+ parts

$4.730

1k+ parts

$4.730

10k+ parts

$4.730

575

-

$4.730

$4.730

$4.730

Verical

USA . 400 parts In-Stock

1+ parts

-

100+ parts

$5.112

1k+ parts

$4.575

10k+ parts

$4.300

400

-

$5.112

$4.575

$4.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,636 parts In-Stock

1+ parts

$4.322

100+ parts

-

1k+ parts

-

10k+ parts

-

1,636

$4.322

-

-

-

Vyrian

USA . 6,455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,455

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 179 parts In-Stock

1+ parts

$3.870

100+ parts

-

1k+ parts

-

10k+ parts

-

179

$3.870

-

-

-

Corohmni

South Africa . 445 parts In-Stock

1+ parts

$3.920

100+ parts

-

1k+ parts

-

10k+ parts

-

445

$3.920

-

-

-

Corphita

USA . 1,073 parts In-Stock

1+ parts

$4.095

100+ parts

-

1k+ parts

-

10k+ parts

-

1,073

$4.095

-

-

-

SupplyDigital Components

Austria . 8,088 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,088

-

-

-

-

Problanco Electronics

Mexico . 7,361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,361

-

-

-

-

TANS Electronics

Latvia . 5,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,170

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Kulean Microsystems

USA . 2,541 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,541

-

-

-

-

Continental Prestige Electronics

USA . 575 parts In-Stock

1+ parts

-

100+ parts

$3.920

1k+ parts

-

10k+ parts

-

575

-

$3.920

-

-

UHIMA Technologies

Türkiye . 491 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

491

-

-

-

-

Microchip USA

USA . 255 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

255

-

-

-

-

Overview

Enhance your display solutions with the LC75897PW-E by Onsemi, a top-tier manufacturer known for its superior quality and reliability. As a leading player in the Graphics Display Drivers category, this product offers seamless integration for various applications, providing unmatched value and benefits to customers. With advanced technology and a wide operating temperature range, this liquid crystal display driver ensures optimal performance and efficiency. Upgrade your displays with Onsemi's LC75897PW-E and experience enhanced visual experiences like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and resistance to heat, making the product long-lasting and reliable.

Display Mode: SEGMENT

Segment display mode provides clear and precise segmented information, ideal for displaying specific data or characters.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Power Supplies (V): 2.7/6

Support for multiple power supply voltages offers flexibility and compatibility with various system configurations.

No. of Terminals: 144

Having a high number of terminals allows for connecting a wide range of components and peripherals, enhancing functionality.

Package Style (Meter): FLATPACK

Flatpack package style saves space on the PCB and ensures a compact design, suitable for applications with limited space.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions, increasing product durability.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold conditions, making the product versatile and adaptable to different environments.

Terminal Finish: TIN BISMUTH

Tin Bismuth terminal finish provides excellent solderability and reliability, ensuring a secure electrical connection for stable performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates that the product can withstand a wide range of temperature fluctuations, suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration, resulting in efficient operation and reduced energy usage.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and inspection during manufacturing, ensuring quality and reliability in production.

No. of Segments: 128

High number of segments allows for displaying detailed and intricate information, making the product suitable for advanced display applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables compact design and precise connection, enhancing the product's overall performance and efficiency.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level 4 indicates that the product is not sensitive to moisture during assembly, ensuring high reliability and quality in manufacturing.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

Liquid Crystal Display Driver interface IC type supports efficient and accurate control of the display, enabling smooth operation and clear visuals.

Technical Specifications

Graphics Display Drivers LC75897PW-E attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

4

No. of Backplanes:

4-BP

No. of Segments:

128

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.7/6

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

1.4 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC75897PW-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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