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LC75812PTS-8565-H

Onsemi

LC75812PTS-8565-H by Onsemi

LC75812PTS-8565-H by Onsemi is a Graphics Display Driver with DOT MATRIX display mode, SERIAL data input, and 3.6V max supply voltage. Ideal for industrial applications requiring a 13-DIGIT, 65-segment LIQUID CRYSTAL DISPLAY DRIVER with a thin profile flatpack package style.

Median Price

$2.628

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 512 parts In-Stock

1+ parts

-

100+ parts

$2.480

1k+ parts

$2.220

10k+ parts

$2.090

512

-

$2.480

$2.220

$2.090

DigiKey

USA . 512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.880

10k+ parts

-

512

-

-

$2.880

-

Farnell

UK . 512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.400

10k+ parts

-

512

-

-

$2.400

-

Verical

USA . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.775

10k+ parts

$2.612

450

-

-

$2.775

$2.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,047 parts In-Stock

1+ parts

$2.632

100+ parts

-

1k+ parts

-

10k+ parts

-

2,047

$2.632

-

-

-

Flip Electronics

USA . 13,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,500

-

-

-

-

Vyrian

USA . 8,157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,157

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 118 parts In-Stock

1+ parts

$2.400

100+ parts

-

1k+ parts

-

10k+ parts

-

118

$2.400

-

-

-

Corphita

USA . 647 parts In-Stock

1+ parts

$2.493

100+ parts

-

1k+ parts

-

10k+ parts

-

647

$2.493

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 17,494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,494

-

-

-

-

SupplyDigital Components

Austria . 5,666 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,666

-

-

-

-

Problanco Electronics

Mexico . 5,303 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,303

-

-

-

-

Kulean Microsystems

USA . 4,629 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,629

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

TANS Electronics

Latvia . 575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

575

-

-

-

-

UHIMA Technologies

Türkiye . 520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

520

-

-

-

-

Continental Prestige Electronics

USA . 512 parts In-Stock

1+ parts

-

100+ parts

$2.400

1k+ parts

-

10k+ parts

-

512

-

$2.400

-

-

Microchip USA

USA . 381 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

381

-

-

-

-

Overview

Enhance your display solutions with the LC75812PTS-8565-H by Onsemi. As a leading manufacturer in the graphics display drivers category, Onsemi guarantees top-notch quality and reliability. This versatile driver, featuring a dot matrix display mode and serial data input, is perfect for a wide range of applications. From industrial to consumer electronics, this product offers exceptional value with its high performance, innovative technology, and industrial-grade temperature tolerance. Upgrade your designs today with Onsemi's LC75812PTS-8565-H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable.

Display Mode: DOT MATRIX

Dot matrix display mode allows for flexible and customizable display options.

Data Input Mode: SERIAL

Serial data input mode allows for efficient communication with the display driver.

Surface Mount: YES

Surface mount capability enables easy and convenient installation onto circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage for reliable performance.

Package Shape: SQUARE

Square package shape facilitates easy integration into electronic devices.

Power Supplies (V): 3/3.3

Dual power supply options provide flexibility in voltage requirements.

No. of Terminals: 100

Ample number of terminals for connecting various components.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Flatpack, thin profile, and fine pitch package style allows for space-saving design.

No. of Backplanes: 9-BP

Multiple backplanes enhance the display capabilities of the driver.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage for efficient power consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature for reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme conditions.

Terminal Finish: TIN BISMUTH

Tin Bismuth terminal finish is environmentally friendly and provides good solderability.

Terminal Position: QUAD

Quad terminal position for secure and stable connections.

Maximum Seated Height: 1.2 mm

Low seated height for compact design requirements.

Width: 14 mm

Narrow width for space-saving installation.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time for efficient manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable solder connections.

Length: 14 mm

Compact length for space-efficient design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade for rugged applications.

Technology: CMOS

CMOS technology for low power consumption and high performance.

Terminal Form: GULL WING

Gull wing terminal form for reliable electrical connections.

Maximum Supply Current: 1 mA

Low maximum supply current for efficient power usage.

No. of Digits/Characters: 13-DIGIT

Supports 13 digits/characters for versatile display options.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

No. of Segments: 65

65 segments for detailed and clear display output.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design requirements.

Moisture Sensitivity Level (MSL): 3

MSL level 3 for moderate sensitivity to moisture exposure.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

Interface IC type specifically designed for driving liquid crystal displays.

Technical Specifications

Graphics Display Drivers LC75812PTS-8565-H attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Display Mode:

DOT MATRIX

Interface IC Type:

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e6

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Backplanes:

9-BP

No. of Digits/Characters:

13-DIGIT

No. of Functions:

1

No. of Segments:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

LC75812PTS-8565-H Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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