Loading...

LB1909M-TE-L-E

Onsemi

LB1909M-TE-L-E by Onsemi

LB1909M-TE-L-E by Onsemi is a Motion Control IC with 12V supply, 10 terminals, and max operating temp of 85 °C. Ideal for applications requiring precise motion control in compact spaces due to its small outline package and surface mount capability.

Median Price

$1.241

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 444 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.010

10k+ parts

$0.903

444

-

$1.220

$1.010

$0.903

DigiKey

USA . 444 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.530

10k+ parts

-

444

-

-

$1.530

-

Farnell

UK . 444 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.879

10k+ parts

-

444

-

-

$0.879

-

Verical

USA . 390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.262

10k+ parts

$1.129

390

-

-

$1.262

$1.129

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 877 parts In-Stock

1+ parts

$0.947

100+ parts

-

1k+ parts

-

10k+ parts

-

877

$0.947

-

-

-

Chip Stock

USA . 69,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

69,000

-

-

-

-

Vyrian

USA . 4,149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,149

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 854 parts In-Stock

1+ parts

$0.897

100+ parts

-

1k+ parts

-

10k+ parts

-

854

$0.897

-

-

-

Corohmni

South Africa . 314 parts In-Stock

1+ parts

$0.997

100+ parts

-

1k+ parts

-

10k+ parts

-

314

$0.997

-

-

-

AZTECH Wire

Italy . 198 parts In-Stock

1+ parts

$9.280

100+ parts

-

1k+ parts

-

10k+ parts

-

198

$9.280

-

-

-

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,000

-

-

-

-

RC Electronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

TANS Electronics

Latvia . 8,313 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,313

-

-

-

-

Kepictronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

SupplyDigital Components

Austria . 6,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,485

-

-

-

-

Problanco Electronics

Mexico . 4,308 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,308

-

-

-

-

Kulean Microsystems

USA . 1,179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,179

-

-

-

-

Continental Prestige Electronics

USA . 290 parts In-Stock

1+ parts

-

100+ parts

$0.851

1k+ parts

-

10k+ parts

-

290

-

$0.851

-

-

Microchip USA

USA . 191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

191

-

-

-

-

UHIMA Technologies

Türkiye . 61 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

61

-

-

-

-

Overview

Elevate your motion control systems with the LB1909M-TE-L-E by Onsemi. Crafted with precision and expertise, Onsemi delivers top-notch quality in every product. This cutting-edge Motion Control IC offers unparalleled performance and reliability, making it a game-changer in various applications. From robotics to automation, this innovative solution provides seamless operation and efficient power management. Experience the next level of control and efficiency with the LB1909M-TE-L-E by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 12V

With a nominal supply voltage of 12V, this product is designed to work efficiently within standard voltage ranges, ensuring compatibility with a wide range of systems.

No. of Terminals: 10

Having 10 terminals provides ample connection points for various components, offering flexibility in designing and configuring the system.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding environments where temperature can fluctuate.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides good conductivity and corrosion resistance, ensuring consistent and stable performance over time.

Maximum Supply Current (Isup): 35 mA

With a maximum supply current of 35mA, the product is designed to operate efficiently without drawing excessive power, contributing to energy savings.

Technical Specifications

Motion Control ICs LB1909M-TE-L-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

35 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LB1909M-TE-L-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20