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LB1838JM-MPB-E

Onsemi

LB1838JM-MPB-E by Onsemi

LB1838JM-MPB-E by Onsemi is a Motion Control IC with 14 terminals, operating voltage of 2.5-9V, and max current of 18mA. Ideal for stepper motor control applications in industrial settings due to its compact size, low profile design, and wide temperature range from -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,674 parts In-Stock

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Digiode

USA . 1,534 parts In-Stock

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AZTECH Wire

Italy . 211 parts In-Stock

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$14.760

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211

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QUARKTWIN TECHNOLOGY LTD

USA . 7,290 parts In-Stock

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Kulean Microsystems

USA . 7,254 parts In-Stock

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TANS Electronics

Latvia . 7,161 parts In-Stock

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SupplyDigital Components

Austria . 7,018 parts In-Stock

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Problanco Electronics

Mexico . 6,958 parts In-Stock

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Microchip USA

USA . 6,478 parts In-Stock

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Perfect Parts

USA . 291 parts In-Stock

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Corohmni

South Africa . 196 parts In-Stock

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Corphita

USA . 78 parts In-Stock

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UHIMA Technologies

Türkiye . 19 parts In-Stock

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Overview

Unlock the potential of your motion control projects with the LB1838JM-MPB-E by Onsemi. This high-quality stepper motor controller offers reliability and precision, thanks to Onsemi's trusted manufacturing expertise. Perfect for industrial applications, this IC provides seamless control and efficient performance. Experience the value and benefits of this product, from its small outline package to its wide operating temperature range. Elevate your projects with the LB1838JM-MPB-E and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external elements, ensuring the longevity and reliability of the product.

Surface Mount: YES

Surface mount capability makes the product easy to integrate onto printed circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3V provides compatibility with a wide range of power sources, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand demanding industrial environments and extended operating durations without overheating.

Technology: BIPOLAR

Utilizing bipolar technology ensures precise control and efficient performance, making the product suitable for high-precision motion control applications.

Terminal Form: GULL WING

The gull wing terminal form provides robust mechanical support and easy soldering connections, enhancing the product's reliability and ease of installation.

Technical Specifications

Motion Control ICs LB1838JM-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO REQUIRE 1.8V TO 9V

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e6

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP14,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

18 mA

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LB1838JM-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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