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LB11967V-W-AH

Onsemi

LB11967V-W-AH by Onsemi

LB11967V-W-AH by Onsemi is a Motion Control IC with 20 terminals, operating b/w -30 to 95 °C. It supports a supply voltage range of 6-16V and offers a max output current of 0.05A. Ideal for Brushless DC Motor control applications due to its compact size and low profile design.

Median Price

$0.664

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,919 parts In-Stock

1+ parts

-

100+ parts

$0.664

1k+ parts

$0.551

10k+ parts

$0.491

1,919

-

$0.664

$0.551

$0.491

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 990 parts In-Stock

1+ parts

$0.517

100+ parts

-

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990

$0.517

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Flip Electronics

USA . 24,000 parts In-Stock

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24,000

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Vyrian

USA . 11,556 parts In-Stock

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11,556

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,678 parts In-Stock

1+ parts

$0.490

100+ parts

-

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1,678

$0.490

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Corohmni

South Africa . 211 parts In-Stock

1+ parts

$0.544

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211

$0.544

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AZTECH Wire

Italy . 498 parts In-Stock

1+ parts

$16.320

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498

$16.320

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Kulean Microsystems

USA . 5,084 parts In-Stock

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5,084

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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SupplyDigital Components

Austria . 1,596 parts In-Stock

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1,596

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Problanco Electronics

Mexico . 855 parts In-Stock

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855

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UHIMA Technologies

Türkiye . 826 parts In-Stock

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826

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Microchip USA

USA . 242 parts In-Stock

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242

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TANS Electronics

Latvia . 192 parts In-Stock

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192

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Overview

Elevate your motion control systems with the LB11967V-W-AH by Onsemi. Crafted with precision and expertise, this high-quality motion control IC offers unparalleled performance and reliability. Perfect for applications requiring precise motor control, this product boasts a wide range of benefits including seamless operation, enhanced efficiency, and long-lasting durability. Trust Onsemi to deliver innovative solutions that exceed expectations and elevate your projects to new heights. Unlock the full potential of your motion control systems with the LB11967V-W-AH today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the IC lightweight and durable, making it suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and reducing manual labor during the manufacturing process.

Nominal Supply Voltage (Vsup): 12 V

The 12V nominal supply voltage makes it compatible with a wide range of power sources, providing flexibility for different system configurations.

No. of Terminals: 20

Having 20 terminals allows for more connections and functions to be integrated into the IC, increasing its versatility and capability.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature of 95 °C, the IC can withstand harsh environmental conditions and prolonged use, ensuring reliable performance in demanding applications.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C enables the IC to function efficiently in cold environments, making it suitable for a wide range of operating conditions.

Width (mm): 4.4 mm

The compact width of 4.4mm allows for the IC to be used in space-constrained applications where size is a critical factor.

Maximum Output Current: 0.05 A

The maximum output current of 0.05A indicates the IC's ability to drive low-power applications efficiently, making it ideal for controlling small motors or devices.

Technology: BIPOLAR

The bipolar technology used in the IC provides precise control and accurate feedback for managing motor speed and position, resulting in smooth and reliable operation.

Technical Specifications

Motion Control ICs LB11967V-W-AH attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e6

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.05 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LB11967V-W-AH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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