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LB11651-E

Onsemi

LB11651-E by Onsemi

LB11651-E by Onsemi is a Motion Control IC with 14 terminals, operating voltage of 3-5.25V, and max output current of 4A. It is used as a Stepper Motor Controller in applications requiring precise motion control at temperatures ranging from -20 to 85°C. Package style includes IN-LINE, HEAT SINK/SLUG, SHRINK PITCH for versatile mounting options.

Median Price

$3.155

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 114 parts In-Stock

1+ parts

-

100+ parts

$2.930

1k+ parts

$2.620

10k+ parts

$2.460

114

-

$2.930

$2.620

$2.460

DigiKey

USA . 114 parts In-Stock

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-

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$3.380

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114

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$3.380

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Distributors (In-Stock)

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Digiode

USA . 234 parts In-Stock

1+ parts

$3.088

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234

$3.088

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Chip Stock

USA . 7,800 parts In-Stock

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7,800

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Vyrian

USA . 2,186 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 498 parts In-Stock

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498

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Distributors (Availability)

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Corphita

USA . 1,022 parts In-Stock

1+ parts

$2.925

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-

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1,022

$2.925

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Corohmni

South Africa . 378 parts In-Stock

1+ parts

$3.250

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378

$3.250

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Allen Electronics Distributors

USA . 25 parts In-Stock

1+ parts

$5.340

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25

$5.340

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SupplyDigital Components

Austria . 4,027 parts In-Stock

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4,027

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Problanco Electronics

Mexico . 3,233 parts In-Stock

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Microchip USA

USA . 384 parts In-Stock

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384

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UHIMA Technologies

Türkiye . 357 parts In-Stock

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357

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TANS Electronics

Latvia . 292 parts In-Stock

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292

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Kulean Microsystems

USA . 219 parts In-Stock

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Overview

Enhance your motion control systems with the LB11651-E by Onsemi, a top-quality stepper motor controller designed to optimize performance and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, you can trust that this IC will deliver superior results in various applications. From robotics to automation, this product offers unmatched value, efficiency, and precision, making it a must-have for customers seeking cutting-edge technology. Elevate your projects with the LB11651-E and experience seamless control like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability for the IC, ensuring long-lasting performance.

Nominal Supply Voltage (Vsup): 5 V

Operates efficiently at a standard voltage, making it compatible with most systems.

Maximum Output Current: 4 A

Capable of handling high output currents, making it suitable for demanding applications.

Technology: BIPOLAR

Bipolar technology offers precise control and efficient performance for motion control applications.

Minimum Supply Voltage (Vsup): 3 V

Can operate at low voltage levels, providing flexibility in different power supply scenarios.

Technical Specifications

Motion Control ICs LB11651-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES IN 8 TO 28V SUPPLY

Other IC type:

JESD-30 Code:

R-PZIP-T14

JESD-609 Code:

e6

Length:

27 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

ZIP14,.06,.09,70

Package Shape:

Package Style (Meter):

IN-LINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

5,24

Qualification:

Not Qualified

Maximum Seated Height:

14.5 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

155 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.78 mm

Terminal Position:

ZIG-ZAG

Width (mm):

4 mm

Trade Compliance

LB11651-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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