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LB11651H

Onsemi

LB11651H by Onsemi

LB11651H by Onsemi is a Motion Control IC with 44 terminals, operating at -20 to 85 °C. It has power supplies of 5V and 24V, suitable for applications requiring bipolar technology and surface mount installation in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,147 parts In-Stock

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Digiode

USA . 53 parts In-Stock

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53

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SupplyDigital Components

Austria . 4,575 parts In-Stock

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4,575

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TANS Electronics

Latvia . 2,563 parts In-Stock

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Problanco Electronics

Mexico . 2,327 parts In-Stock

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Kulean Microsystems

USA . 797 parts In-Stock

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Corphita

USA . 677 parts In-Stock

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Corohmni

South Africa . 476 parts In-Stock

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UHIMA Technologies

Türkiye . 310 parts In-Stock

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Overview

Elevate your motion control systems with the LB11651H from Onsemi, a leading manufacturer known for top-quality products. This innovative Motion Control IC offers unparalleled precision and reliability, making it ideal for a wide range of applications. With its advanced technology and robust design, this product ensures seamless operation and superior performance. Experience the value and benefits of the LB11651H, and take your projects to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product ideal for applications where weight and reliability are important factors.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and enabling high-density designs.

Power Supplies (V): 5,24

Support for dual power supply voltages (5V and 24V) offers flexibility in powering the device based on the application requirements.

No. of Terminals: 44

Higher number of terminals provide ample connectivity options and interfaces for integrating the product into complex systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in demanding industrial environments where temperatures may fluctuate.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows the product to function well in cold conditions, expanding its usability across various temperature ranges.

Technology: BIPOLAR

Bipolar technology offers precise control and high-speed operation, making the product suitable for applications requiring accurate motion control.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and secure connections, enhancing the product's reliability and ease of installation.

Technical Specifications

Motion Control ICs LB11651H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G44

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP44,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5,24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Trade Compliance

LB11651H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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