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LB11620T

Onsemi

LB11620T by Onsemi

LB11620T by Onsemi is a Motion Control IC with 24 terminals, operating voltage of 8-17V, and output current of 0.03A. It is a Brushless DC Motor Controller in a small outline package suitable for applications requiring precise motion control at temperatures ranging from -20 to 100 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,278 parts In-Stock

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Vyrian

USA . 624 parts In-Stock

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624

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Problanco Electronics

Mexico . 7,505 parts In-Stock

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SupplyDigital Components

Austria . 7,288 parts In-Stock

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UHIMA Technologies

Türkiye . 907 parts In-Stock

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Kulean Microsystems

USA . 667 parts In-Stock

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Corphita

USA . 507 parts In-Stock

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TANS Electronics

Latvia . 322 parts In-Stock

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Corohmni

South Africa . 156 parts In-Stock

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Overview

Experience the cutting-edge technology of the LB11620T by Onsemi, a top-tier manufacturer known for producing high-quality Motion Control ICs. This innovative product offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. From robotics to automotive systems, the LB11620T provides exceptional value and benefits to customers looking for precise control and efficiency. Trust Onsemi to deliver excellence in every aspect of motion control technology with the LB11620T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body makes the IC lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable makes the IC easy to integrate into various circuit designs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 12 V

With a nominal supply voltage of 12V, this IC is compatible with many standard power supplies, making it easy to incorporate into existing systems.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100 °C, this IC can withstand harsh environmental conditions and prolonged use without malfunctioning.

Width (mm): 4.4 mm

The compact width of 4.4mm allows for high-density PCB layouts, making it suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 8 V

The low minimum supply voltage requirement of 8V allows for flexibility in power supply options, accommodating a wide range of applications.

Maximum Output Current: 0.03 A

The high maximum output current of 0.03A allows the IC to drive various load types, making it versatile for different motor control applications.

Technical Specifications

Motion Control ICs LB11620T attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES IN 4.5 TO 5.5V SUPPLY

JESD-30 Code:

R-PDSO-G24

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.03 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

16 mA

Maximum Supply Voltage (Vsup):

17 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LB11620T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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