Loading...

LB11610P

Onsemi

LB11610P by Onsemi

LB11610P by Onsemi is a Motion Control IC with 44 terminals, operating at -40 to 85 °C. It has power supplies of 5V and 12V, drawing a max supply current of 23mA. This rectangular-shaped IC in plastic/epoxy package is ideal for industrial applications requiring precise motion control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,197

-

-

-

-

Digiode

USA . 392 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

392

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 6,904 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,904

-

-

-

-

Kulean Microsystems

USA . 3,545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,545

-

-

-

-

Corphita

USA . 1,865 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,865

-

-

-

-

Problanco Electronics

Mexico . 773 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

773

-

-

-

-

Corohmni

South Africa . 491 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

491

-

-

-

-

UHIMA Technologies

Türkiye . 462 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

462

-

-

-

-

TANS Electronics

Latvia . 154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

154

-

-

-

-

Overview

Elevate your motion control applications with the LB11610P by Onsemi. Known for their superior quality and innovation, Onsemi delivers cutting-edge solutions in the Motion Control ICs category. With a package body material of PLASTIC/EPOXY and surface mount capability, this product offers versatility and reliability. The LB11610P operates at a wide temperature range, making it ideal for industrial use. Experience seamless power supplies at 5V and 12V, with 44 terminals for enhanced functionality. Trust Onsemi to provide top-of-the-line products that exceed expectations in performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for rugged industrial applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during production.

Power Supplies (V): 5,12

Support for multiple power supply voltages (5V and 12V) provides flexibility in design and compatibility with various systems.

No. of Terminals: 44

Having 44 terminals allows for increased connectivity options and interfacing with multiple components or peripherals.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable operation even in extreme cold temperatures.

Terminal Position: DUAL

Dual terminal positions offer increased flexibility in PCB layout and wiring configurations for optimal space utilization.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can operate reliably in demanding environments with high temperature fluctuations.

Maximum Supply Current (Isup): 23 mA

With a maximum supply current of 23mA, this product is power-efficient and helps minimize energy consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and ensure a strong and reliable electrical connection for enhanced performance.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for high-density mounting, saving space on the PCB and enabling compact designs.

Technical Specifications

Motion Control ICs LB11610P attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G44

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP44,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

23 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Trade Compliance

LB11610P Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20