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LB11600JV-MPB-E

Onsemi

LB11600JV-MPB-E by Onsemi

LB11600JV-MPB-E by Onsemi is a Motion Control IC with 30 terminals, operating voltage of 4.5-14V, and max output current of 0.04A. Ideal for industrial applications requiring brushless DC motor control in a compact package measuring 9.75mm x 5.6mm with temp range -40 to 100 °C.

Median Price

$1.762

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,048 parts In-Stock

1+ parts

-

100+ parts

$1.580

1k+ parts

$1.410

10k+ parts

$1.330

2,048

-

$1.580

$1.410

$1.330

DigiKey

USA . 2,048 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.080

10k+ parts

-

2,048

-

-

$2.080

-

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.762

10k+ parts

-

2,000

-

-

$1.762

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,212 parts In-Stock

1+ parts

$1.560

100+ parts

-

1k+ parts

-

10k+ parts

-

2,212

$1.560

-

-

-

Digiode

USA . 1,319 parts In-Stock

1+ parts

$1.682

100+ parts

-

1k+ parts

-

10k+ parts

-

1,319

$1.682

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 95 parts In-Stock

1+ parts

$1.560

100+ parts

-

1k+ parts

-

10k+ parts

-

95

$1.560

-

-

-

Corphita

USA . 63 parts In-Stock

1+ parts

$1.593

100+ parts

-

1k+ parts

-

10k+ parts

-

63

$1.593

-

-

-

TANS Electronics

Latvia . 6,649 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,649

-

-

-

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Problanco Electronics

Mexico . 6,295 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,295

-

-

-

-

Continental Prestige Electronics

USA . 2,048 parts In-Stock

1+ parts

-

100+ parts

$1.510

1k+ parts

-

10k+ parts

-

2,048

-

$1.510

-

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Kulean Microsystems

USA . 1,877 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,877

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-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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1,000

-

-

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SupplyDigital Components

Austria . 557 parts In-Stock

1+ parts

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100+ parts

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557

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Microchip USA

USA . 210 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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210

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UHIMA Technologies

Türkiye . 189 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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189

-

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Overview

Unleash the power of precision motion control with the LB11600JV-MPB-E by Onsemi. Designed with top-notch quality and expertise from Onsemi, this motion control IC promises superior performance and reliability. Ideal for a wide range of applications, this product offers unparalleled value, benefits, and advantages to customers seeking seamless integration and efficient operation. Elevate your projects with the LB11600JV-MPB-E and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards.

Nominal Supply Voltage (Vsup): 5 V

This voltage requirement is common and easily achievable in most applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliability even in harsh environments.

Technology: BIPOLAR

Bipolar technology offers high performance and efficiency in controlling brushless DC motors.

Technical Specifications

Motion Control ICs LB11600JV-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e6

Length:

9.75 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.04 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP30,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

27 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

5.6 mm

Trade Compliance

LB11600JV-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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