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LB11921T-MPB-E

Onsemi

LB11921T-MPB-E by Onsemi

LB11921T-MPB-E by Onsemi is a Motion Control IC with 36 terminals, operating at -20 to 80 °C. It has a supply voltage range of 4.4V to 7V and output current of 0.01A, suitable for Brushless DC Motor Controllers in commercial applications.

Median Price

$1.350

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 96 parts In-Stock

1+ parts

-

100+ parts

$1.350

1k+ parts

$1.120

10k+ parts

$0.999

96

-

$1.350

$1.120

$0.999

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,162 parts In-Stock

1+ parts

$1.054

100+ parts

-

1k+ parts

-

10k+ parts

-

1,162

$1.054

-

-

-

Vyrian

USA . 7,220 parts In-Stock

1+ parts

-

100+ parts

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7,220

-

-

-

-

Distributors (Availability)

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Corphita

USA . 695 parts In-Stock

1+ parts

$0.999

100+ parts

-

1k+ parts

-

10k+ parts

-

695

$0.999

-

-

-

Corohmni

South Africa . 329 parts In-Stock

1+ parts

$1.110

100+ parts

-

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329

$1.110

-

-

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AZTECH Wire

Italy . 1,219 parts In-Stock

1+ parts

$18.510

100+ parts

-

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10k+ parts

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1,219

$18.510

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$18.853

100+ parts

$17.156

1k+ parts

$15.459

10k+ parts

-

1,000

$18.853

$17.156

$15.459

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,204 parts In-Stock

1+ parts

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21,204

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Problanco Electronics

Mexico . 7,150 parts In-Stock

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7,150

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-

-

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Kulean Microsystems

USA . 6,519 parts In-Stock

1+ parts

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6,519

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TANS Electronics

Latvia . 5,187 parts In-Stock

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5,187

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Microchip USA

USA . 4,415 parts In-Stock

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4,415

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UHIMA Technologies

Türkiye . 541 parts In-Stock

1+ parts

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100+ parts

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541

-

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SupplyDigital Components

Austria . 105 parts In-Stock

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105

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Overview

Experience the seamless precision and reliability of the LB11921T-MPB-E by Onsemi, a top-tier manufacturer of motion control ICs. This innovative product offers unmatched performance in controlling brushless DC motors, making it ideal for a wide range of applications. Elevate your projects with this compact, high-quality IC that operates at a nominal supply voltage of 5V and delivers a maximum output current of 0.01A. Trust Onsemi to deliver cutting-edge technology that ensures optimal functionality, efficiency, and value for all your motion control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection for the IC, making it suitable for various environmental conditions.

Surface Mount: YES

Easy surface mounting capability allows for simplified and efficient PCB assembly processes.

Nominal Supply Voltage (Vsup): 5 V

Stable supply voltage of 5V ensures consistent performance of the motion control IC.

No. of Terminals: 36

Having 36 terminals provides plenty of connectivity options for interfacing with external components and peripherals.

Maximum Operating Temperature: 80 °C

High maximum operating temperature tolerance of 80 °C allows for reliable operation in challenging environments.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature of -20 °C ensures functionality even in cold conditions.

Terminal Finish: TIN BISMUTH

Tin Bismuth terminal finish offers good solderability and conductivity for robust connections.

Width (mm): 5.6 mm

Compact width of 5.6mm allows for space-saving integration in small electronics applications.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

Being a brushless DC motor controller, this IC offers efficient and precise control over motor operations.

Maximum Supply Current (Isup): 32 mA

Low maximum supply current requirement of 32mA helps in reducing power consumption and heat generation.

Maximum Output Current: 0.01 A

The maximum output current of 0.01A allows for driving various loads with sufficient current capacity.

Technical Specifications

Motion Control ICs LB11921T-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e6

Length:

9.75 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.01 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP36,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

32 mA

Maximum Supply Voltage (Vsup):

7 V

Minimum Supply Voltage (Vsup):

4.4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

5.6 mm

Trade Compliance

LB11921T-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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