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LB11899J-MPB-E

Onsemi

LB11899J-MPB-E by Onsemi

LB11899J-MPB-E by Onsemi is a Motion Control IC with 44 terminals, operating at -20 to 75 °C. It has a supply voltage range of 4-6V and can handle up to 1.1A output current. Ideal for Disk Drive Motor Controllers due to its small outline package and low profile design.

Median Price

$1.815

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,045 parts In-Stock

1+ parts

-

100+ parts

$1.570

1k+ parts

$1.400

10k+ parts

$1.320

1,045

-

$1.570

$1.400

$1.320

DigiKey

USA . 1,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.060

10k+ parts

-

1,045

-

-

$2.060

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,338 parts In-Stock

1+ parts

$1.653

100+ parts

-

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2,338

$1.653

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Vyrian

USA . 6,426 parts In-Stock

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6,426

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Distributors (Availability)

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Ampacity Inc.

Singapore . 747 parts In-Stock

1+ parts

$1.480

100+ parts

-

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747

$1.480

-

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Corphita

USA . 1,143 parts In-Stock

1+ parts

$1.566

100+ parts

-

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10k+ parts

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1,143

$1.566

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Corohmni

South Africa . 53 parts In-Stock

1+ parts

$1.740

100+ parts

-

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53

$1.740

-

-

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AZTECH Wire

Italy . 1,115 parts In-Stock

1+ parts

$14.470

100+ parts

-

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1,115

$14.470

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SupplyDigital Components

Austria . 6,603 parts In-Stock

1+ parts

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6,603

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Problanco Electronics

Mexico . 5,583 parts In-Stock

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5,583

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TANS Electronics

Latvia . 3,972 parts In-Stock

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3,972

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Continental Prestige Electronics

USA . 1,045 parts In-Stock

1+ parts

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100+ parts

$1.490

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1,045

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$1.490

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Kulean Microsystems

USA . 875 parts In-Stock

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875

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Microchip USA

USA . 259 parts In-Stock

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259

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Perfect Parts

USA . 223 parts In-Stock

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223

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UHIMA Technologies

Türkiye . 11 parts In-Stock

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11

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Overview

Enhance your motion control applications with the LB11899J-MPB-E by Onsemi. With a reputation for top-quality manufacturing, Onsemi delivers reliable and efficient solutions for various industries. The LB11899J-MPB-E is a versatile and high-performance Motion Control IC that offers unparalleled value to its users. From disk drive motor controllers to other innovative technologies, this product provides superior functionality and ease of use. Experience the benefits of seamless operation and enhanced performance with the LB11899J-MPB-E by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the IC.

Surface Mount: YES

Allows for easy installation and integration into circuit boards, saving time and effort.

Nominal Supply Voltage (Vsup): 5 V

Compatible with common power sources, making it easy to incorporate into various applications.

Maximum Output Current: 1.1 A

Capable of handling a relatively high current, providing the necessary power for motion control applications.

Technology: BIPOLAR

Bipolar technology offers fast switching speeds, making this IC suitable for precise motion control applications.

Technical Specifications

Motion Control ICs LB11899J-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e6

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

1.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP44,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,12

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

25 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.6 mm

Trade Compliance

LB11899J-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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