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LB11660RV-TLM-E

Onsemi

LB11660RV-TLM-E by Onsemi

LB11660RV-TLM-E by Onsemi is a Motion Control IC with 16 terminals, operating voltage of 4-15V. It features a small outline package, suitable for Brushless DC Motor Controllers. With a max output current of 1.5A and operating temperature range of -30 to 95 °C, it is ideal for motion control applications.

Median Price

$0.910

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,164 parts In-Stock

1+ parts

-

100+ parts

$0.910

1k+ parts

$0.755

10k+ parts

$0.673

4,164

-

$0.910

$0.755

$0.673

Distributors (In-Stock)

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Digiode

USA . 594 parts In-Stock

1+ parts

$0.707

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594

$0.707

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Chip Stock

USA . 53,000 parts In-Stock

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Vyrian

USA . 9,221 parts In-Stock

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Flip Electronics

USA . 2,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 333 parts In-Stock

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333

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Bristol Electronics

USA . 333 parts In-Stock

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Dan-Mar Components

USA . 333 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,615 parts In-Stock

1+ parts

$0.670

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$0.670

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Corohmni

South Africa . 399 parts In-Stock

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$0.744

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399

$0.744

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Andel Nordic

Denmark . 1,880 parts In-Stock

1+ parts

$8.035

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$7.713

10k+ parts

$7.713

1,880

$8.035

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$7.713

$7.713

AZTECH Wire

Italy . 316 parts In-Stock

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$9.870

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$9.870

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Component Stockers USA

USA . 274 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 5,428 parts In-Stock

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TANS Electronics

Latvia . 2,914 parts In-Stock

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Kepictronics

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Problanco Electronics

Mexico . 1,357 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Microchip USA

USA . 395 parts In-Stock

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395

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UHIMA Technologies

Türkiye . 94 parts In-Stock

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SupplyDigital Components

Austria . 60 parts In-Stock

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Overview

Experience seamless motion control like never before with the LB11660RV-TLM-E by Onsemi. Crafted with precision and reliability in mind, this Motion Control IC offers unparalleled performance for a wide range of applications. From robotics to automotive systems, this product delivers smooth and efficient operation, making it a must-have for any project requiring precise motion control. Trust in Onsemi's reputation for quality and innovation, and elevate your products to new heights with the LB11660RV-TLM-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable makes it easier for assembly and reduces the overall size of the product, saving valuable space on the PCB.

Nominal Supply Voltage (Vsup): 12 V

Operating at a 12V nominal supply voltage makes it compatible with a wide range of power sources and increases flexibility in design.

Maximum Operating Temperature: 95 °C

With a maximum operating temperature of 95 °C, the product can withstand high temperature environments, improving reliability and performance.

Width (mm): 4.4 mm

The compact width of 4.4 mm allows for tight placement on the PCB, optimizing space usage in the overall system design.

Minimum Supply Voltage (Vsup): 4 V

The ability to operate at a low minimum supply voltage of 4V makes it suitable for applications where power efficiency and low voltage operation are critical.

Maximum Output Current: 1.5 A

With a maximum output current of 1.5A, the product is capable of driving high current loads, making it suitable for powering motors and other high current devices.

Technical Specifications

Motion Control ICs LB11660RV-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES IN 3 TO 15V SUPPLY

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Length:

5.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

12 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LB11660RV-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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