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J112RLRP

Onsemi

J112RLRP by Onsemi

J112RLRP by Onsemi is a N-CHANNEL FET with 50 ohm RDS(on) and 5 pF Crss. Ideal for CHOPPER applications, it operates in DEPLETION MODE at up to 150 °C. The THROUGH-HOLE package has a CYLINDRICAL shape made of PLASTIC/EPOXY material.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,940 parts In-Stock

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Vyrian

USA . 1,698 parts In-Stock

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Problanco Electronics

Mexico . 6,360 parts In-Stock

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6,360

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Kulean Microsystems

USA . 3,839 parts In-Stock

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SupplyDigital Components

Austria . 3,072 parts In-Stock

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TANS Electronics

Latvia . 2,481 parts In-Stock

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Corphita

USA . 1,096 parts In-Stock

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Corohmni

South Africa . 420 parts In-Stock

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UHIMA Technologies

Türkiye . 358 parts In-Stock

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Overview

Unlock the power of precision and reliability with the J112RLRP from Onsemi, a leading manufacturer in the field of Small Signal Field Effect Transistors. Perfect for chopper applications, this N-channel transistor offers superior performance and efficiency. Its advanced technology and high-quality construction ensure optimal functionality even in demanding conditions. Experience the seamless operation and unmatched durability that the J112RLRP provides, making it the ideal choice for your electronic projects. Elevate your designs with this innovative solution and enjoy the peace of mind that comes with using a top-tier product like the J112RLRP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the transistor, ensuring reliable performance and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better performance characteristics and lower on-resistance compared to P-channel transistors, making them a preferred choice for many applications.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easier to use in different applications.

Transistor Application: CHOPPER

Choppers are used for various power electronics applications, making this transistor suitable for high frequency and high power applications.

Package Shape: ROUND

Round package shape allows for efficient heat dissipation and compact design, making it suitable for space-constrained applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connection and easy soldering, ensuring reliable connection in various circuits.

Operating Mode: DEPLETION MODE

Depletion mode operation offers simple biasing schemes and can provide higher transconductance, making it suitable for low noise amplification.

No. of Terminals: 3

3 terminals allow for easy connections in a circuit, providing flexibility in design and integration.

Package Style (Meter): CYLINDRICAL

Cylindrical package style provides good mechanical strength and ease of handling, making it suitable for various applications.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high input impedance and low noise performance, making it suitable for signal processing applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for reliable operation in harsh environments and high power applications.

Transistor Element Material: SILICON

Silicon material offers good thermal conductivity and high electron mobility, ensuring efficient performance and reliability.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and reliable electrical connection, ensuring long-term performance.

Maximum Drain-Source On Resistance: 50 ohm

Low drain-source on resistance allows for efficient power dissipation and low power losses, making it suitable for high power applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB mounting and good heat dissipation, ensuring reliable operation in various applications.

Maximum Feedback Capacitance (Crss): 5 pF

Low feedback capacitance helps in reducing signal distortions and improving high frequency performance, making it suitable for high-speed applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) J112RLRP attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain-Source On Resistance:

50 ohm

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

CHOPPER

Transistor Element Material:

SILICON

Trade Compliance

J112RLRP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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