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FQP8P10

Onsemi

FQP8P10 by Onsemi

FQP8P10 by Onsemi is a P-CHANNEL Power FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 32A and EAS of 150mJ, making it suitable for high-power tasks. With a max power dissipation of 65W and operating temperature up to 175 °C, this MOSFET offers reliable performance in various environments.

Median Price

$0.625

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,948 parts In-Stock

1+ parts

-

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$0.670

1,948

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$0.670

Flip Electronics (Authorized)

USA . 1,948 parts In-Stock

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1,948

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Verical

USA . 876 parts In-Stock

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$0.625

10k+ parts

$0.557

876

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$0.625

$0.557

Rochester

USA . 324 parts In-Stock

1+ parts

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100+ parts

$0.603

1k+ parts

$0.500

10k+ parts

$0.446

324

-

$0.603

$0.500

$0.446

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,466 parts In-Stock

1+ parts

$0.493

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2,466

$0.493

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Vyrian

USA . 1,044 parts In-Stock

1+ parts

$0.519

100+ parts

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1,044

$0.519

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Flip Electronics

USA . 1,948 parts In-Stock

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1,948

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Cyclops Electronics Ltd

UK . 914 parts In-Stock

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914

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Mentor Electronics Marketing, LLC

USA . 800 parts In-Stock

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800

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ComSIT Distribution GmbH

Germany . 750 parts In-Stock

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750

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Chip Stock

USA . 151 parts In-Stock

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151

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,731 parts In-Stock

1+ parts

$0.467

100+ parts

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10k+ parts

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2,731

$0.467

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Corohmni

South Africa . 70 parts In-Stock

1+ parts

$0.519

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70

$0.519

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Native Components

USA . 372 parts In-Stock

1+ parts

$0.630

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372

$0.630

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Northwest PG Solutions

USA . 1,978 parts In-Stock

1+ parts

$0.693

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1,978

$0.693

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Microchip USA

USA . 279 parts In-Stock

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$7.280

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279

$7.280

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Kepictronics

USA . 10,065 parts In-Stock

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Kulean Microsystems

USA . 6,070 parts In-Stock

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SupplyDigital Components

Austria . 5,978 parts In-Stock

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5,978

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Problanco Electronics

Mexico . 5,830 parts In-Stock

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5,830

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 4,138 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Perfect Parts

USA . 3,699 parts In-Stock

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Supply Digital

USA . 2,425 parts In-Stock

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Eastek

USA . 1,000 parts In-Stock

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 232 parts In-Stock

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232

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Overview

Enhance the performance of your electronic devices with the FQP8P10 Power FET by Onsemi. Manufactured with precision and reliability, this P-Channel transistor is ideal for switching applications, offering a breakthrough in power management technology. With a high DS Breakdown Voltage and an impressive Maximum Drain Current, this product guarantees top-notch efficiency and durability. Upgrade your systems today with the FQP8P10 and experience unmatched quality and performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material makes the product lightweight and durable, ensuring easy handling and long-lasting performance.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low conduction resistance and fast switching speeds, making them ideal for efficient power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient energy recovery in inductive loads and helps protect the circuit from voltage spikes, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures efficient power control and regulation in various electronic devices.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage rating ensures reliable operation in high voltage applications, making this FET suitable for demanding power electronics circuits.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into circuit boards, saving space and simplifying the overall design.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure connections and easy soldering, ensuring a stable electrical connection in the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and low power consumption, making them efficient for various power management applications.

Maximum Pulsed Drain Current (IDM): 32 A

The high pulsed drain current rating allows for reliable current handling during transient conditions, making this FET suitable for applications with short bursts of high power.

Avalanche Energy Rating (EAS): 150 mJ

The high avalanche energy rating ensures the FET can withstand voltage spikes and transient events without any damage, enhancing the robustness of the product.

Maximum Drain Current (Abs) (ID): 8 A

The high maximum drain current rating allows for reliable continuous current handling, making this FET suitable for various power electronics applications.

No. of Terminals: 3

The three terminals provide convenient connections for the FET in the circuit, allowing for easy integration and wiring.

Maximum Power Dissipation (Abs): 65 W

The high power dissipation rating ensures the FET can handle power efficiently without overheating, allowing for reliable operation in high-power applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure mounting to external surfaces, providing mechanical stability and heat dissipation for the FET.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low on-resistance, and excellent efficiency, making this FET suitable for high-performance power management applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature rating ensures the FET can operate reliably in harsh environments with elevated temperatures, enhancing the versatility of the product.

Transistor Element Material: SILICON

Silicon-based FETs offer high performance, low conduction losses, and reliability, making them suitable for a wide range of power electronics applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability and stable connections in the circuit.

Maximum Drain-Source On Resistance: 0.53 ohm

The low drain-source on-resistance minimizes power losses and improves efficiency in the FET, making it ideal for high-power applications where low conduction losses are critical.

Terminal Position: SINGLE

The single terminal position simplifies the installation and connection of the FET in the circuit, ensuring ease of use and reliable performance.

Technical Specifications

Power Field Effect Transistors (FET) FQP8P10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

150 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.53 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

32 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP8P10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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