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FQP8N90C

Onsemi

FQP8N90C by Onsemi

FQP8N90C by Onsemi is a N-CHANNEL Power FET with 900V DS Breakdown Voltage and 25A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and operates in ENHANCEMENT MODE. With a max power dissipation of 171W, this transistor has a max operating temperature of 150 °C.

Median Price

$1.225

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1 parts In-Stock

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$0.662

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$0.662

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Chip1Stop

Japan . 1 parts In-Stock

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Rochester

USA . 730 parts In-Stock

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$1.320

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$1.180

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$1.110

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Verical

USA . 730 parts In-Stock

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$1.563

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Digiode

USA . 1,281 parts In-Stock

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$0.629

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Vyrian

USA . 3,262 parts In-Stock

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Chip Stock

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Ack Elektronik San.Tic.Ltd.Sti

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Bristol Electronics

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Native Components

USA . 576 parts In-Stock

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$0.188

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$0.180

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$0.180

Northwest PG Solutions

USA . 2,343 parts In-Stock

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$0.207

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$0.182

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Corphita

USA . 1,546 parts In-Stock

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$0.596

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Corohmni

South Africa . 377 parts In-Stock

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Component Stockers USA

USA . 1 parts In-Stock

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$0.770

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$1.780

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A-Z Elektronik GmbH

Germany . 11,465 parts In-Stock

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TANS Electronics

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Problanco Electronics

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Alle Elektronik GmbH

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Kulean Microsystems

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SupplyDigital Components

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Perfect Parts

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Infinite Electronics LLP (Excess)

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Authorized Procurement Solutions

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UHIMA Technologies

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Kepictronics

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Microchip USA

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Overview

Enhance your power management systems with the FQP8N90C by Onsemi. This N-CHANNEL Power Field Effect Transistor is designed for switching applications, offering a maximum operating temperature of 150 °C and a Minimum DS Breakdown Voltage of 900V. With a maximum power dissipation of 171W and a configuration of single with built-in diode, this transistor provides reliability and efficiency. Whether you're in the automotive industry or working on industrial equipment, this transistor's high-quality construction and innovative technology will deliver the performance you need. Elevate your projects with the FQP8N90C and experience the difference Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics than P-channel FETs, making this product a good choice for switching applications.

Minimum DS Breakdown Voltage: 900 V

With a high breakdown voltage, this transistor can handle high voltages without breakdown, making it reliable for use in power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and typically have faster switching speeds, making this product suitable for high-performance applications.

Maximum Drain Current (ID): 6.3 A

With a high drain current rating, this transistor can handle high current loads, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 171 W

This high power dissipation rating allows the transistor to handle high power levels without overheating, making it suitable for power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making this product suitable for high-performance applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature rating, this transistor can operate reliably even in high-temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) FQP8N90C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

850 mJ

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

6.3 A

Maximum Drain Current (ID):

6.3 A

Maximum Drain-Source On Resistance:

1.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

25 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP8N90C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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