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FQP9N90C

Onsemi

FQP9N90C by Onsemi

FQP9N90C by Onsemi is a N-CHANNEL Power FET with 900V DS Breakdown Voltage, ideal for SWITCHING applications. It features 32A Max Pulsed Drain Current and 1.4ohm Max RDS(on), operating in ENHANCEMENT MODE at up to 150 °C.

Median Price

$4.753

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Newark

USA . 421 parts In-Stock

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$3.120

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421

$3.120

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Farnell

UK . 425 parts In-Stock

1+ parts

$4.320

100+ parts

$2.040

1k+ parts

$1.780

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425

$4.320

$2.040

$1.780

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Arrow

USA . 1,825 parts In-Stock

1+ parts

$4.753

100+ parts

$2.332

1k+ parts

$1.891

10k+ parts

-

1,825

$4.753

$2.332

$1.891

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Mouser Electronics

USA . 1,507 parts In-Stock

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$5.020

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$2.380

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$2.130

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1,507

$5.020

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$2.130

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DigiKey

USA . 630 parts In-Stock

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$5.020

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$2.373

1k+ parts

$1.839

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630

$5.020

$2.373

$1.839

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Element14

Singapore . 425 parts In-Stock

1+ parts

$7.260

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$3.440

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$3.000

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425

$7.260

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$3.000

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Verical

USA . 2,272 parts In-Stock

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Rochester

USA . 86 parts In-Stock

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$1.840

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$1.650

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$1.550

86

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$1.840

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$1.550

Distributors (In-Stock)

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Digiode

USA . 2,984 parts In-Stock

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$1.938

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$1.938

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Vyrian

USA . 2,691 parts In-Stock

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$2.040

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$2.040

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TME

Poland . 68 parts In-Stock

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$4.730

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68

$4.730

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ComSIT Distribution GmbH

Germany . 21,050 parts In-Stock

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Flip Electronics

USA . 3,600 parts In-Stock

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3,600

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NAC Semi

USA . 1,050 parts In-Stock

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$9.220

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$8.510

1,050

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$9.220

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$8.510

First Choice Components Inc.

USA . 100 parts In-Stock

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100

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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Prism Electronics

USA . 8 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 759 parts In-Stock

1+ parts

$0.278

100+ parts

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$0.267

759

$0.278

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$0.267

Northwest PG Solutions

USA . 1,112 parts In-Stock

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$0.306

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$0.270

1,112

$0.306

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$0.270

Corphita

USA . 2,482 parts In-Stock

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$1.836

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2,482

$1.836

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Corohmni

South Africa . 268 parts In-Stock

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$2.040

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268

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 28,633 parts In-Stock

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Microchip USA

USA . 11,872 parts In-Stock

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Perfect Parts

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Kulean Microsystems

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TANS Electronics

Latvia . 4,442 parts In-Stock

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SupplyDigital Components

Austria . 1,711 parts In-Stock

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Problanco Electronics

Mexico . 1,469 parts In-Stock

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UHIMA Technologies

Türkiye . 873 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

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GreenTree Electronics

Israel . 184 parts In-Stock

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Kepictronics

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Assy Fe

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Overview

Looking for a high-quality Power Field Effect Transistor? Look no further than the FQP9N90C by Onsemi! With its N-CHANNEL configuration and built-in diode, this transistor is perfect for switching applications. Offering a maximum DS Breakdown Voltage of 900V and a Maximum Drain Current of 8A, this transistor provides reliable performance and efficiency. Don't settle for less when you can have the best with Onsemi's FQP9N90C!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance and efficiency compared to P-Channel FETs, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and offers protection against reverse current flow, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast and efficient on/off operation in electronic circuits.

Minimum DS Breakdown Voltage: 900 V

A high breakdown voltage allows the FET to handle high voltage levels without breakdown, making it suitable for high-power applications.

Maximum Pulsed Drain Current (IDM): 32 A

With a high pulsed drain current rating, this FET can handle temporary surges in current without damage, making it reliable in high-stress situations.

Maximum Power Dissipation (Abs): 205 W

The high power dissipation rating indicates the FET's ability to dissipate heat effectively, ensuring reliability and longevity in demanding environments.

Maximum Drain-Source On Resistance: 1.4 ohm

Low on-resistance results in minimal power loss and heat generation in the FET, improving overall efficiency and performance.

Technical Specifications

Power Field Effect Transistors (FET) FQP9N90C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

900 mJ

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

32 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP9N90C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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