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FQP8N60C

Onsemi

FQP8N60C by Onsemi

FQP8N60C by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it has a Max IDM of 30A and EAS of 230mJ. This METAL-OXIDE SEMICONDUCTOR device operates in ENHANCEMENT MODE at up to 150°C, featuring a low 1.2 ohm RDS(on) for efficient performance.

Median Price

$1.639

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 954 parts In-Stock

1+ parts

$2.390

100+ parts

$1.590

1k+ parts

$1.130

10k+ parts

$1.070

954

$2.390

$1.590

$1.130

$1.070

Rochester

USA . 5,143 parts In-Stock

1+ parts

-

100+ parts

$1.430

1k+ parts

$1.190

10k+ parts

$1.060

5,143

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$1.430

$1.190

$1.060

DigiKey

USA . 5,143 parts In-Stock

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$1.790

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5,143

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$1.790

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Verical

USA . 4,800 parts In-Stock

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$1.488

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$1.325

4,800

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$1.325

Flip Electronics (Authorized)

USA . 918 parts In-Stock

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Digiode

USA . 729 parts In-Stock

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$1.112

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DigiKey Marketplace

USA . 6,143 parts In-Stock

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Vyrian

USA . 3,011 parts In-Stock

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Euro-Tech

UK . 995 parts In-Stock

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Flip Electronics

USA . 918 parts In-Stock

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918

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Nova Conductors

Japan . 870 parts In-Stock

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ComSIT Distribution GmbH

Germany . 567 parts In-Stock

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Semicontronic

India . 3,300 parts In-Stock

1+ parts

$0.970

100+ parts

$0.946

1k+ parts

$0.941

10k+ parts

-

3,300

$0.970

$0.946

$0.941

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Ampacity Inc.

Singapore . 3,172 parts In-Stock

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$0.970

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$0.970

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Corphita

USA . 2,146 parts In-Stock

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$1.053

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$1.053

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Corohmni

South Africa . 301 parts In-Stock

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$1.142

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301

$1.142

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Aztec Data Supply Inc.

USA . 4,893 parts In-Stock

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$1.743

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$1.743

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Microchip USA

USA . 350 parts In-Stock

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$15.405

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350

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Kepictronics

USA . 88,000 parts In-Stock

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GreenTree Electronics

Israel . 30,000 parts In-Stock

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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Perfect Parts

USA . 8,430 parts In-Stock

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Lixinc

USA . 6,959 parts In-Stock

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Problanco Electronics

Mexico . 5,379 parts In-Stock

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Argo Parts USA

USA . 4,098 parts In-Stock

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Assy Fe

Spain . 2,603 parts In-Stock

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SupplyDigital Components

Austria . 2,040 parts In-Stock

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Aranea Global

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S.R.D Solutions

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TANS Electronics

Latvia . 1,230 parts In-Stock

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Kulean Microsystems

USA . 790 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 372 parts In-Stock

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Continental Prestige Electronics

USA . 180 parts In-Stock

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$1.160

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Overview

Looking for a reliable power field effect transistor (FET) to enhance your switching applications? Look no further than the FQP8N60C by Onsemi! With a durable plastic/epoxy package body, N-Channel configuration, and built-in diode, this transistor offers a breakthrough in performance and reliability. Perfect for enhancing mode operations, this transistor provides a maximum pulsed drain current of 30A and a minimum DS breakdown voltage of 600V. Trust Onsemi's superior technology and quality materials to deliver top-notch results for your projects. Elevate your applications with the FQP8N60C today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the FET lightweight and durable, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making them suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse polarity, making it convenient and reliable to use.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast and efficient switching performance.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage allows the FET to handle high voltage applications, providing reliability and safety.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and space-saving integration into various electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, ensuring stable electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer improved control and performance characteristics, making them ideal for various circuit designs.

Maximum Pulsed Drain Current (IDM): 30 A

The high pulsed drain current rating allows the FET to handle short-duration peak currents without damage, ensuring reliability under heavy loads.

Avalanche Energy Rating (EAS): 230 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes and transient conditions, enhancing its durability and reliability.

No. of Terminals: 3

Having three terminals allows for easy integration into electronic circuits, providing flexibility in design and functionality.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting options and efficient heat dissipation, enhancing the FET's reliability and performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high-performance characteristics, low power consumption, and reliability, making it suitable for a wide range of applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the FET to operate in harsh environments without compromising performance, providing durability and reliability.

Transistor Element Material: SILICON

Silicon transistors offer high efficiency, low power consumption, and reliability, making them suitable for various electronic applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable electrical connections and long-term performance.

Maximum Drain Current (ID): 7.5 A

The high maximum drain current rating allows the FET to handle continuous current flow without overheating, ensuring stable performance under heavy loads.

Maximum Drain-Source On Resistance: 1.2 ohm

The low on-resistance minimizes power dissipation and improves efficiency, making the FET suitable for high-frequency switching applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and installation, making the FET easy to use and integrate into electronic devices.

Technical Specifications

Power Field Effect Transistors (FET) FQP8N60C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

FAST SWITCHING

Avalanche Energy Rating (EAS):

230 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

7.5 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP8N60C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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