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FQPF8N60C

Onsemi

FQPF8N60C by Onsemi

FQPF8N60C by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it has a Max IDM of 30A and EAS of 230mJ. With a Single configuration and built-in diode, this transistor operates in ENHANCEMENT MODE at up to 150°C.

Median Price

$1.006

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 43,107 parts In-Stock

1+ parts

-

100+ parts

$0.987

1k+ parts

$0.819

10k+ parts

$0.730

43,107

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$0.987

$0.819

$0.730

Verical

USA . 42,512 parts In-Stock

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-

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$1.024

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$0.913

42,512

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$1.024

$0.913

Flip Electronics (Authorized)

USA . 3,460 parts In-Stock

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3,460

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Nova Conductors

Japan . 10 parts In-Stock

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$0.721

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10

$0.721

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Digiode

USA . 730 parts In-Stock

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$0.769

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730

$0.769

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Vyrian

USA . 29,567 parts In-Stock

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Flip Electronics

USA . 460 parts In-Stock

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460

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ACDS - Activité Composants Distribution Service

France . 75 parts In-Stock

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75

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Holdelec - ElecDif-Pro

France . 75 parts In-Stock

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75

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LittleDiode

UK . 6 parts In-Stock

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IBS Electronics

USA . 3 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 29,387 parts In-Stock

1+ parts

$0.690

100+ parts

$0.673

1k+ parts

$0.669

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-

29,387

$0.690

$0.673

$0.669

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Ampacity Inc.

Singapore . 29,289 parts In-Stock

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$0.690

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29,289

$0.690

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Corohmni

South Africa . 126 parts In-Stock

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$0.707

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126

$0.707

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Continental Prestige Electronics

USA . 2,529 parts In-Stock

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$0.721

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$0.707

2,529

$0.721

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$0.707

Argo Parts USA

USA . 1,138 parts In-Stock

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$0.721

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1,138

$0.721

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Netroflash

USA . 100 parts In-Stock

1+ parts

$0.721

100+ parts

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$0.685

10k+ parts

$0.671

100

$0.721

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$0.685

$0.671

Corphita

USA . 2,114 parts In-Stock

1+ parts

$0.728

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2,114

$0.728

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Aztec Data Supply Inc.

USA . 3,241 parts In-Stock

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$1.446

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$1.446

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Perfect Parts

USA . 157,595 parts In-Stock

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157,595

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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GreenTree Electronics

Israel . 30,000 parts In-Stock

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Kepictronics

USA . 22,900 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,598 parts In-Stock

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Kulean Microsystems

USA . 5,454 parts In-Stock

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SupplyDigital Components

Austria . 5,420 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 4,503 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Problanco Electronics

Mexico . 1,766 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,554 parts In-Stock

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Supply Digital

USA . 1,479 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,036 parts In-Stock

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Assy Fe

Spain . 1,001 parts In-Stock

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UHIMA Technologies

Türkiye . 253 parts In-Stock

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Overview

Unleash the power of innovation with the FQPF8N60C by Onsemi. As a leading manufacturer in the industry, Onsemi's Power Field Effect Transistors are known for their high quality and reliability. Ideal for switching applications, this N-CHANNEL transistor offers a seamless performance with a built-in diode for added convenience. With a maximum pulsed drain current of 30A and a minimum DS breakdown voltage of 600V, this transistor ensures efficient operation even in the most demanding situations. Upgrade your projects with the FQPF8N60C and experience the unmatched value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and lower resistance compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against voltage spikes, enhancing the overall reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast and efficient switching performance.

Minimum DS Breakdown Voltage: 600 V

Can handle high voltage applications, providing a safety margin and reliability in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and placement in circuit boards and systems.

Terminal Form: THROUGH-HOLE

Suitable for through-hole mounting, which provides strong mechanical support and stability for the FET.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easy to use and offer high input impedance, making them ideal for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 30 A

Capable of handling high pulsed currents, making it suitable for applications that require high power output.

Avalanche Energy Rating (EAS): 230 mJ

Can withstand energy spikes and transient overvoltages, providing protection against power surges.

No. of Terminals: 3

Simple 3-terminal design for easy integration into circuits and systems.

Package Style (Meter): FLANGE MOUNT

Allows for secure mounting and heat dissipation in a variety of applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Advanced MOSFET technology offers high switching speeds and low power consumption, making it efficient for various applications.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for industrial and high-power applications.

Transistor Element Material: SILICON

Silicon offers high reliability and performance, making it a trusted material for transistor elements.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and corrosion resistance for reliable connections.

Maximum Drain Current (ID): 7.5 A

Can handle high continuous currents, making it suitable for applications with sustained power requirements.

Maximum Drain-Source On Resistance: 1.2 ohm

Low on-resistance means lower power dissipation and higher efficiency in switching applications.

Terminal Position: SINGLE

Single terminal position simplifies installation and connectivity in circuits.

Case Connection: ISOLATED

Isolated case connection helps prevent electrical interference and ensures safe operation in circuits.

Technical Specifications

Power Field Effect Transistors (FET) FQPF8N60C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

FAST SWITCHING

Avalanche Energy Rating (EAS):

230 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

7.5 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQPF8N60C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-653-7657, 5961016537657

NIIN

016537657

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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