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FQP85N06

Onsemi

FQP85N06 by Onsemi

FQP85N06 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 85A Max Drain Current, 0.01 ohm Max RDS(on), and 300A IDM. Operating in ENHANCEMENT MODE, it has a max power dissipation of 160W and can withstand up to 175°C.

Median Price

$1.805

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 378 parts In-Stock

1+ parts

$1.390

100+ parts

$1.310

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$1.180

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378

$1.390

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$1.180

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Adafruit Industries

USA . 1,000 parts In-Stock

1+ parts

$2.220

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$2.020

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$1.820

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1,000

$2.220

$2.020

$1.820

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Distributors (In-Stock)

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Digiode

USA . 1,948 parts In-Stock

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$1.320

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$1.320

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Nova Conductors

Japan . 76 parts In-Stock

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$2.134

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76

$2.134

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TME

Poland . 174 parts In-Stock

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$2.950

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$1.820

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Chip Stock

USA . 924 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 400 parts In-Stock

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Vyrian

USA . 375 parts In-Stock

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375

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Holdelec - ElecDif-Pro

France . 200 parts In-Stock

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200

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Bristol Electronics

USA . 200 parts In-Stock

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200

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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LittleDiode

UK . 19 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 549 parts In-Stock

1+ parts

$1.180

100+ parts

$1.150

1k+ parts

$1.145

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549

$1.180

$1.150

$1.145

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Ampacity Inc.

Singapore . 296 parts In-Stock

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$1.180

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296

$1.180

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Corphita

USA . 1,553 parts In-Stock

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$1.251

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$1.251

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Corohmni

South Africa . 308 parts In-Stock

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$1.440

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308

$1.440

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Argo Parts USA

USA . 911 parts In-Stock

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$1.452

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911

$1.452

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Aztec Data Supply Inc.

USA . 837 parts In-Stock

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$1.932

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837

$1.932

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Continental Prestige Electronics

USA . 2,511 parts In-Stock

1+ parts

$2.060

100+ parts

$1.410

1k+ parts

$1.020

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2,511

$2.060

$1.410

$1.020

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.220

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$2.020

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$1.820

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1,000

$2.220

$2.020

$1.820

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Microchip USA

USA . 239 parts In-Stock

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$17.420

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239

$17.420

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Component Stockers USA

USA . 760 parts In-Stock

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$99.990

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760

$99.990

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RC Electronics

USA . 38,922 parts In-Stock

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$1.470

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$1.340

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$1.300

38,922

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$1.470

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$1.300

Kepictronics

USA . 8,065 parts In-Stock

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Problanco Electronics

Mexico . 6,739 parts In-Stock

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TANS Electronics

Latvia . 5,194 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,809 parts In-Stock

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Kulean Microsystems

USA . 4,222 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,206 parts In-Stock

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SupplyDigital Components

Austria . 2,863 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Supply Digital

USA . 1,810 parts In-Stock

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Authorized Procurement Solutions

USA . 900 parts In-Stock

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900

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UHIMA Technologies

Türkiye . 879 parts In-Stock

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879

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Lixinc

USA . 261 parts In-Stock

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Overview

Enhance the performance of your power switching applications with the FQP85N06 by Onsemi. Crafted with precision and expertise, this N-channel Power Field Effect Transistor offers unparalleled reliability and efficiency. Whether you're looking to optimize your power management systems or upgrade your electronic devices, this product delivers exceptional quality and value. Trust Onsemi's reputation for excellence and choose the FQP85N06 for all your switching needs. Unlock new possibilities and elevate your projects with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the transistor lightweight and durable, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility, offering better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current flow protection, enhancing overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in such scenarios.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage provides robust protection against voltage spikes and overloads.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into various electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and stable connections, reducing the risk of disconnection or damage.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer faster switching speeds and lower resistance, improving overall efficiency.

Maximum Pulsed Drain Current (IDM): 300 A

The high pulsed drain current capability enables the transistor to handle sudden high-current pulses without damage.

Avalanche Energy Rating (EAS): 810 mJ

The high avalanche energy rating ensures reliable performance in applications with high-energy transient events.

Maximum Drain Current (Abs) (ID): 85 A

The high maximum drain current rating allows the transistor to handle substantial continuous current loads.

No. of Terminals: 3

Having 3 terminals provides the necessary connections for proper operation and control of the transistor.

Maximum Power Dissipation (Abs): 160 W

The high power dissipation capability allows the transistor to handle high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount package style enables easy and secure mounting onto a heatsink for improved thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high efficiency, fast switching speeds, and low power consumption.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, the transistor can withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material known for its high performance and durability.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good electrical conductivity and solderability for reliable connections.

Maximum Drain-Source On Resistance: 0.01 ohm

The low drain-source on resistance results in lower power dissipation and improved efficiency in the transistor.

Terminal Position: SINGLE

Single terminal position simplifies installation and wiring, making the transistor user-friendly.

Technical Specifications

Power Field Effect Transistors (FET) FQP85N06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

810 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

85 A

Maximum Drain Current (ID):

85 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

300 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP85N06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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