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FQP8N80C

Onsemi

FQP8N80C by Onsemi

FQP8N80C by Onsemi is a power field effect transistor (FET) with a min DS breakdown voltage of 800V. It is an N-channel transistor with a max pulsed drain current of 32A, making it suitable for switching applications. Its package style is flange mount and it operates in enhancement mode.

Median Price

$3.845

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,500 parts In-Stock

1+ parts

$1.690

100+ parts

$1.660

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$1.620

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3,500

$1.690

$1.660

$1.620

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Farnell

UK . 1,776 parts In-Stock

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$2.100

100+ parts

$1.130

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$0.825

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1,776

$2.100

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$0.825

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Element14

Singapore . 1,776 parts In-Stock

1+ parts

$3.660

100+ parts

$2.480

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$1.820

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1,776

$3.660

$2.480

$1.820

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Mouser Electronics

USA . 623 parts In-Stock

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$4.030

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$1.900

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$1.640

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623

$4.030

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$1.640

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DigiKey

USA . 1,000 parts In-Stock

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$4.150

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$1.923

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$1.468

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$1.423

1,000

$4.150

$1.923

$1.468

$1.423

Newark

USA . 893 parts In-Stock

1+ parts

$4.270

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$1.980

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$1.630

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893

$4.270

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$1.630

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Verical

USA . 740 parts In-Stock

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$2.427

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740

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$2.427

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Arrow

USA . 150 parts In-Stock

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$4.103

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150

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$4.103

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Distributors (In-Stock)

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Freelance Electronics

USA . 4 parts In-Stock

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$0.909

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-

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4

$0.909

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Nova Conductors

Japan . 10 parts In-Stock

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$1.595

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10

$1.595

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Digiode

USA . 1,815 parts In-Stock

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$2.090

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$2.090

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Chip Stock

USA . 43,800 parts In-Stock

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Sensible Micro Corp

USA . 2,000 parts In-Stock

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2,000

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Vyrian

USA . 1,938 parts In-Stock

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1,938

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Sea View Technologies

USA . 780 parts In-Stock

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780

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Bristol Electronics

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780

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ComSIT Distribution GmbH

Germany . 232 parts In-Stock

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232

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Ack Elektronik San.Tic.Ltd.Sti

. 151 parts In-Stock

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EMSNET

USA . 90 parts In-Stock

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90

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PC Components Company LLC

USA . 50 parts In-Stock

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50

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Sunrise Surplus Inc.

USA . 50 parts In-Stock

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50

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LWI Electronics Inc

India . 26 parts In-Stock

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26

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Distributors (Availability)

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Corohmni

South Africa . 436 parts In-Stock

1+ parts

$0.909

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436

$0.909

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Netroflash

USA . 1,000 parts In-Stock

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$1.595

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1,000

$1.595

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Ampacity Inc.

Singapore . 2,318 parts In-Stock

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$1.870

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2,318

$1.870

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Corphita

USA . 1,985 parts In-Stock

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$1.980

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1,985

$1.980

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Andel Nordic

Denmark . 233 parts In-Stock

1+ parts

$7.080

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$6.797

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$6.797

233

$7.080

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$6.797

$6.797

Microchip USA

USA . 5,095 parts In-Stock

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$19.435

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5,095

$19.435

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Perfect Parts

USA . 69,440 parts In-Stock

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69,440

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

USA . 30,000 parts In-Stock

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Lixinc

USA . 18,946 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,042 parts In-Stock

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SupplyDigital Components

Austria . 4,823 parts In-Stock

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4,823

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Problanco Electronics

Mexico . 4,449 parts In-Stock

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Kulean Microsystems

USA . 3,970 parts In-Stock

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3,970

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S.R.D Solutions

India . 2,000 parts In-Stock

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TANS Electronics

Latvia . 922 parts In-Stock

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Supply Digital

USA . 597 parts In-Stock

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597

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UHIMA Technologies

Türkiye . 508 parts In-Stock

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508

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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iodParts Technologies Inc.

India . 90 parts In-Stock

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90

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Overview

Discover the FQP8N80C by Onsemi, a high-quality Power Field Effect Transistor (FET) that promises to revolutionize your switching applications. With its exceptional performance and built-in diode, this N-CHANNEL transistor offers unparalleled reliability and efficiency. Experience the benefits of enhanced power dissipation and a maximum pulsed drain current of 32A. Perfect for both industrial and consumer electronics, the FQP8N80C guarantees optimal functionality and longevity. Trust in Onsemi, a leading manufacturer known for their cutting-edge technology and commitment to customer satisfaction. Upgrade your systems today with the FQP8N80C and unlock a world of possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and protection, making it suitable for various harsh environments.

Polarity or Channel Type: N-CHANNEL

The N-channel design of this product enables efficient and low-resistance current flow, enhancing overall performance and reliability.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this single configuration FET provides reverse polarity protection, simplifying circuit design and offering added convenience.

Transistor Application: SWITCHING

Designed specifically for switching applications, this power FET offers fast, efficient and reliable switching performance, making it ideal for a wide range of applications.

Minimum DS Breakdown Voltage: 800 V

With a minimum DS breakdown voltage of 800V, this FET can handle high voltage circuits effectively, ensuring reliable operation in demanding applications.

Package Shape: RECTANGULAR

The rectangular package shape of this FET allows for easy integration and installation, making it versatile and suitable for various circuit designs.

Terminal Form: THROUGH-HOLE

The through-hole terminal form of this FET simplifies the assembly process, providing secure and reliable connections, making it suitable for both manual and automated assembly.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operating mode of this FET allows for high control and precision, enabling it to deliver efficient and accurate performance in various applications.

No. of Elements: 1

With a single element, this FET provides a straightforward and simplified design, reducing complexity and enhancing overall reliability.

Maximum Pulsed Drain Current (IDM): 32 A

This FET can handle maximum pulsed drain currents of up to 32A, making it suitable for applications with high peak current requirements.

Avalanche Energy Rating (EAS): 850 mJ

The high avalanche energy rating of 850mJ ensures increased durability and protection against energy spikes, making it suitable for demanding and rugged applications.

Maximum Drain Current (Abs) (ID): 8 A

With a maximum drain current of 8A, this FET can handle moderate current requirements, making it suitable for a wide range of applications.

No. of Terminals: 3

With three terminals, this FET provides the necessary connections for efficient circuit integration, making it versatile and compatible with various designs.

Maximum Power Dissipation (Abs): 178 W

This FET has a maximum power dissipation of 178W, allowing it to handle high power applications effectively and ensuring reliable operation under challenging conditions.

Package Style (Meter): FLANGE MOUNT

The flange mount package style of this FET offers secure and stable mounting, ensuring mechanical stability and efficient heat dissipation, making it suitable for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

With metal-oxide semiconductor technology, this FET provides excellent performance, reliability, and efficiency, making it a robust choice for various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high-temperature environments, ensuring reliable operation even in demanding conditions.

Transistor Element Material: SILICON

The silicon-based transistor element material of this FET delivers excellent performance, longevity, and reliability, making it a preferred choice for various applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin (Sn) annealed terminal finish ensures corrosion resistance and solderability, enhancing the overall reliability and lifespan of the product.

Maximum Drain-Source On Resistance: 1.55 ohm

With a maximum drain-source on resistance of 1.55 ohms, this FET offers low resistance, reducing power losses and improving overall efficiency.

Terminal Position: SINGLE

The single terminal position of this FET simplifies the installation process, ensuring ease of use and compatibility with various circuit layouts.

Technical Specifications

Power Field Effect Transistors (FET) FQP8N80C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

850 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

1.55 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

32 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP8N80C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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