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FGH15T120SMD-F155

Onsemi

FGH15T120SMD-F155 by Onsemi

FGH15T120SMD-F155 by Onsemi is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 30A max collector current, and 333W max power dissipation. Ideal for power control applications due to its single configuration with built-in diode and fast turn-off time of 534ns. Package style is flange mount with through-hole terminals.

Median Price

$5.050

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 120 parts In-Stock

1+ parts

$4.670

100+ parts

$4.390

1k+ parts

$3.970

10k+ parts

-

120

$4.670

$4.390

$3.970

-

Farnell

UK . 1,186 parts In-Stock

1+ parts

$5.430

100+ parts

$3.100

1k+ parts

$2.700

10k+ parts

-

1,186

$5.430

$3.100

$2.700

-

Element14

Singapore . 1,196 parts In-Stock

1+ parts

$7.790

100+ parts

$4.390

1k+ parts

$3.880

10k+ parts

-

1,196

$7.790

$4.390

$3.880

-

Verical

USA . 7,377 parts In-Stock

1+ parts

-

100+ parts

$2.345

1k+ parts

$2.256

10k+ parts

-

7,377

-

$2.345

$2.256

-

RS (Exports)

UK . 882 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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882

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 665 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

-

10k+ parts

-

665

$3.750

-

-

-

Digiode

USA . 1,052 parts In-Stock

1+ parts

$4.436

100+ parts

-

1k+ parts

-

10k+ parts

-

1,052

$4.436

-

-

-

Bristol Electronics

USA . 900 parts In-Stock

1+ parts

$6.384

100+ parts

$2.766

1k+ parts

$2.617

10k+ parts

-

900

$6.384

$2.766

$2.617

-

Vyrian

USA . 8,959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,959

-

-

-

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Dan-Mar Components

USA . 1,169 parts In-Stock

1+ parts

-

100+ parts

-

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1,169

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-

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Chip Stock

USA . 375 parts In-Stock

1+ parts

-

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-

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375

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,172 parts In-Stock

1+ parts

$1.990

100+ parts

-

1k+ parts

-

10k+ parts

-

5,172

$1.990

-

-

-

Corohmni

South Africa . 69 parts In-Stock

1+ parts

$2.345

100+ parts

-

1k+ parts

-

10k+ parts

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69

$2.345

-

-

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$3.675

100+ parts

-

1k+ parts

$3.528

10k+ parts

-

50

$3.675

-

$3.528

-

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

$3.750

100+ parts

$3.562

1k+ parts

$3.384

10k+ parts

$3.338

120

$3.750

$3.562

$3.384

$3.338

Corphita

USA . 2,306 parts In-Stock

1+ parts

$4.203

100+ parts

-

1k+ parts

-

10k+ parts

-

2,306

$4.203

-

-

-

AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$21.900

100+ parts

-

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737

$21.900

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Perfect Parts

USA . 7,056 parts In-Stock

1+ parts

-

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7,056

-

-

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TANS Electronics

Latvia . 6,309 parts In-Stock

1+ parts

-

100+ parts

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6,309

-

-

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

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5,000

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-

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Kulean Microsystems

USA . 3,955 parts In-Stock

1+ parts

-

100+ parts

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3,955

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-

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Supply Digital

USA . 2,544 parts In-Stock

1+ parts

-

100+ parts

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2,544

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SupplyDigital Components

Austria . 613 parts In-Stock

1+ parts

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613

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Problanco Electronics

Mexico . 464 parts In-Stock

1+ parts

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464

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-

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UHIMA Technologies

Türkiye . 233 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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233

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Overview

Unleash the power of innovation with the FGH15T120SMD-F155 by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. The FGH15T120SMD-F155 is the epitome of excellence, offering unparalleled performance in power control applications. With a maximum operating temperature of 175 °C and a collector-emitter voltage of 1200 V, this transistor ensures optimal efficiency and reliability. Say goodbye to compromises and hello to superior technology with the FGH15T120SMD-F155 by Onsemi.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides a durable and cost-effective option for housing the IGBT.

Polarity or Channel Type

N-CHANNEL - Offers efficient power control for various applications.

Configuration

SINGLE WITH BUILT-IN DIODE - Simplifies circuit design and saves space.

Transistor Application

POWER CONTROL - Ideal for managing high power levels accurately.

Package Shape

RECTANGULAR - Allows for easy installation and mounting in different systems.

Terminal Form

THROUGH-HOLE - Ensures secure connections and reliable performance.

Nominal Turn Off Time (toff)

534 ns - Enables quick switching and efficient power management.

No. of Terminals

3 - Simplifies wiring and connections within the circuit.

Maximum Power Dissipation (Abs)

333 W - Handles high power levels effectively without overheating.

Package Style (Meter)

FLANGE MOUNT - Facilitates easy integration into a variety of systems.

Maximum Operating Temperature

175 °C - Ensures stable performance even in high-temperature environments.

Maximum Collector-Emitter Voltage

1200 V - Allows for handling high voltage levels safely and efficiently.

Transistor Element Material

SILICON - Provides reliable performance and durability.

Maximum Gate-Emitter Voltage

25 V - Safeguards the transistor from voltage spikes and overloads.

Maximum Collector Current (IC)

30 A - Handles high current levels for power-intensive applications.

Maximum Gate-Emitter Threshold Voltage

7.5 V - Ensures precise control over the gate signal for efficient power management.

Terminal Position

SINGLE - Simplifies connections and installation in the circuit.

Case Connection

COLLECTOR - Facilitates effective heat dissipation and ensures long-term reliability.

Nominal Turn On Time (ton)

74 ns - Provides fast response times for precise power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH15T120SMD-F155 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

25 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

534 ns

Nominal Turn On Time (ton):

74 ns

Trade Compliance

FGH15T120SMD-F155 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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