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FGH12040WD-F155

Onsemi

FGH12040WD-F155 by Onsemi

FGH12040WD-F155 by Onsemi is an N-CHANNEL IGBT with 1200V VCEsat, 80A IC, and 428W power dissipation. Ideal for power control applications, it features a built-in diode, 630ns turn-off time, and operates b/w -55 to 175 °C.

Median Price

$3.548

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 779 parts In-Stock

1+ parts

-

100+ parts

$3.070

1k+ parts

$2.750

10k+ parts

$2.580

779

-

$3.070

$2.750

$2.580

Verical

USA . 342 parts In-Stock

1+ parts

-

100+ parts

$4.025

1k+ parts

$3.600

10k+ parts

$3.388

342

-

$4.025

$3.600

$3.388

Distributors (In-Stock)

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Digiode

USA . 2,465 parts In-Stock

1+ parts

$3.392

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2,465

$3.392

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Vyrian

USA . 2,903 parts In-Stock

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$3.570

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2,903

$3.570

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 36 parts In-Stock

1+ parts

$1.380

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36

$1.380

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Northwest PG Solutions

USA . 1,452 parts In-Stock

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$1.518

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1,452

$1.518

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Corphita

USA . 980 parts In-Stock

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$3.213

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980

$3.213

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Corohmni

South Africa . 314 parts In-Stock

1+ parts

$3.570

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314

$3.570

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Perfect Parts

USA . 29,232 parts In-Stock

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29,232

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QUARKTWIN TECHNOLOGY LTD

USA . 20,938 parts In-Stock

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20,938

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TANS Electronics

Latvia . 7,776 parts In-Stock

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7,776

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Kulean Microsystems

USA . 6,780 parts In-Stock

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6,780

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Kepictronics

USA . 6,000 parts In-Stock

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SupplyDigital Components

Austria . 5,814 parts In-Stock

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Problanco Electronics

Mexico . 5,569 parts In-Stock

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Supply Digital

USA . 1,928 parts In-Stock

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1,928

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UHIMA Technologies

Türkiye . 648 parts In-Stock

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648

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Overview

Enhance your power control needs with the FGH12040WD-F155 Insulated Gate Bipolar Transistor by Onsemi. With a maximum VCEsat of 2.9V and a maximum collector current of 80A, this N-channel transistor offers superior performance and reliability for a wide range of applications. From industrial automation to renewable energy systems, this single configuration transistor provides efficient power control with a built-in diode, ensuring optimal functionality. Trust in Onsemi's reputation for quality and innovation and experience the value and benefits that the FGH12040WD-F155 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the IGBT suitable for a variety of environments.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable performance in high-power situations.

Maximum VCEsat: 2.9 V

Low saturation voltage helps improve efficiency and reduce power losses.

Package Shape: RECTANGULAR

Easy to mount and integrate into existing systems.

Terminal Form: THROUGH-HOLE

Simplifies installation and allows for easy connection in through-hole assembly.

Nominal Turn Off Time (toff): 630 ns

Fast turn-off time improves overall performance and efficiency in power control applications.

No. of Terminals: 3

Simple and straightforward wiring setup for ease of use.

Maximum Power Dissipation (Abs): 428 W

High power dissipation capability allows for handling of large power loads.

Package Style (Meter): FLANGE MOUNT

Allows for secure mounting and heat dissipation in applications where high power is a concern.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without sacrificing performance.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating makes it suitable for high-power applications.

Transistor Element Material: SILICON

Silicon material provides reliability and efficiency for power control applications.

Maximum Gate-Emitter Voltage: 25 V

Prevents damage to the transistor during operation by limiting the gate-emitter voltage.

Minimum Operating Temperature: -55 °C

Capable of operating in low-temperature environments without loss of performance.

Maximum Collector Current (IC): 80 A

Can handle high current loads for power control applications.

Maximum Gate-Emitter Threshold Voltage: 8 V

Optimal gate-emitter voltage threshold for efficient switching performance.

Terminal Position: SINGLE

Simplified design for ease of connection and installation.

Nominal Turn On Time (ton): 116 ns

Fast turn-on time for quick response in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH12040WD-F155 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

8 V

Maximum Gate-Emitter Voltage:

25 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

630 ns

Nominal Turn On Time (ton):

116 ns

Maximum VCEsat:

2.9 V

Trade Compliance

FGH12040WD-F155 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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