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FDS6975

Onsemi

FDS6975 by Onsemi

FDS6975 by Onsemi is a P-CHANNEL Power FET with 30V DS Breakdown Voltage and 6A Drain Current. It features a separate configuration with built-in diode, suitable for switching applications. This MOSFET has a max power dissipation of 2W in a small outline package, operating at up to 150°C.

Median Price

$0.687

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 350 parts In-Stock

1+ parts

$0.548

100+ parts

$0.499

1k+ parts

$0.449

10k+ parts

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350

$0.548

$0.499

$0.449

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Arrow

USA . 89 parts In-Stock

1+ parts

$0.973

100+ parts

$0.542

1k+ parts

-

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89

$0.973

$0.542

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Chip1Stop

Japan . 1,422 parts In-Stock

1+ parts

$0.984

100+ parts

$0.711

1k+ parts

$0.622

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1,422

$0.984

$0.711

$0.622

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Mouser Electronics

USA . 5,204 parts In-Stock

1+ parts

$2.060

100+ parts

$0.883

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-

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5,204

$2.060

$0.883

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Rochester

USA . 36,970 parts In-Stock

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-

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$0.674

1k+ parts

$0.560

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$0.499

36,970

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$0.674

$0.560

$0.499

Verical

USA . 24,472 parts In-Stock

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-

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$0.700

10k+ parts

$0.624

24,472

-

-

$0.700

$0.624

RS (Exports)

UK . 789 parts In-Stock

1+ parts

-

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$0.615

789

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$0.615

DigiKey

USA . 608 parts In-Stock

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$0.503

608

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$0.503

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,422 parts In-Stock

1+ parts

$0.521

100+ parts

-

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1,422

$0.521

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.669

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-

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50

$0.669

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Mobius Materials

USA . 4,194 parts In-Stock

1+ parts

$0.670

100+ parts

$0.540

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-

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4,194

$0.670

$0.540

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DF Sales Co.

USA . 112 parts In-Stock

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$0.800

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112

$0.800

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DF Sales Co.

USA . 112 parts In-Stock

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$0.800

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112

$0.800

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EXC GmbH

Germany . 258 parts In-Stock

1+ parts

$0.925

100+ parts

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258

$0.925

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Bristol Electronics

USA . 10,400 parts In-Stock

1+ parts

$1.688

100+ parts

$0.624

1k+ parts

$0.439

10k+ parts

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10,400

$1.688

$0.624

$0.439

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Dan-Mar Components

USA . 10,400 parts In-Stock

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10,400

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Martec Srl

Italy . 8,454 parts In-Stock

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8,454

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LIBRA Elektronik GmbH

Germany . 6,390 parts In-Stock

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6,390

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Vyrian

USA . 6,086 parts In-Stock

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6,086

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Chip Stock

USA . 5,660 parts In-Stock

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5,660

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Flip Electronics

USA . 3,060 parts In-Stock

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3,060

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Prism Electronics

USA . 2,552 parts In-Stock

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2,552

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R&J Components

USA . 2,500 parts In-Stock

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2,500

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ACDS - Activité Composants Distribution Service

France . 2,495 parts In-Stock

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2,495

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ComSIT Distribution GmbH

Germany . 1,687 parts In-Stock

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1,687

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Ashlea Components Ltd

UK . 1,411 parts In-Stock

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1,411

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Sensible Micro Corp

USA . 55 parts In-Stock

1+ parts

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100+ parts

$1.306

1k+ parts

$1.206

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55

-

$1.306

$1.206

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EMSNET

USA . 55 parts In-Stock

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55

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Sea View Technologies

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,163 parts In-Stock

1+ parts

$0.466

100+ parts

-

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6,163

$0.466

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Corphita

USA . 679 parts In-Stock

1+ parts

$0.493

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679

$0.493

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$0.548

100+ parts

$0.499

1k+ parts

$0.449

10k+ parts

-

350

$0.548

$0.499

$0.449

-

Corohmni

South Africa . 53 parts In-Stock

1+ parts

$0.548

100+ parts

-

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53

$0.548

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Argo Parts USA

USA . 3,685 parts In-Stock

1+ parts

$0.669

100+ parts

-

1k+ parts

-

10k+ parts

$0.649

3,685

$0.669

-

-

$0.649

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.669

100+ parts

-

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100

$0.669

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Aztec Data Supply Inc.

USA . 749 parts In-Stock

1+ parts

$1.860

100+ parts

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749

$1.860

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Microchip USA

USA . 608 parts In-Stock

1+ parts

$11.924

100+ parts

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608

$11.924

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Perfect Parts

USA . 74,824 parts In-Stock

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74,824

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Continental Prestige Electronics

USA . 37,346 parts In-Stock

1+ parts

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$0.542

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37,346

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-

$0.542

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Kepictronics

USA . 10,000 parts In-Stock

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10,000

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TANS Electronics

Latvia . 8,234 parts In-Stock

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8,234

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Kulean Microsystems

USA . 8,090 parts In-Stock

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8,090

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Problanco Electronics

Mexico . 6,584 parts In-Stock

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6,584

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Cyclops Electronics Ltd (Excess)

UK . 4,332 parts In-Stock

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4,332

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RC Electronics

USA . 3,420 parts In-Stock

1+ parts

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100+ parts

$0.730

1k+ parts

$0.690

10k+ parts

$0.670

3,420

-

$0.730

$0.690

$0.670

SupplyDigital Components

Austria . 3,368 parts In-Stock

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3,368

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Assy Fe

Spain . 2,300 parts In-Stock

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2,300

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UHIMA Technologies

Türkiye . 960 parts In-Stock

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960

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Supply Digital

USA . 644 parts In-Stock

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644

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Overview

Unleash the power of innovation with the FDS6975 by Onsemi, a high-quality P-Channel Power Field Effect Transistor designed for switching applications. With its compact design and built-in diode, this transistor offers unparalleled efficiency and reliability. Whether you're looking to optimize power management or enhance circuit performance, the FDS6975 delivers unmatched value and performance. Join the ranks of industry leaders who trust Onsemi for top-notch semiconductor solutions and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to external elements, ensuring the longevity of the product.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low RDS(on) values and are suitable for high-side switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The separate configuration with built-in diode provides flexibility in circuit design and allows for easier integration into different applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient power management capabilities.

Surface Mount: YES

Being surface mountable makes the FET easy to mount on PCBs, saving space and enhancing the overall design of the electronic system.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes in the circuit.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and mounting on the PCB, enabling efficient use of space.

Terminal Form: GULL WING

The gull-wing terminal form offers secure connections and ease of soldering during the assembly process.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the FET and ensures low power consumption when the device is off.

No. of Elements: 2

Having two elements provides redundancy and increases the reliability of the FET in the circuit.

Maximum Pulsed Drain Current (IDM): 20 A

The high pulsed drain current rating allows the FET to handle large current spikes without being damaged, making it suitable for high-power applications.

Maximum Drain Current (Abs) (ID): 6 A

The rated maximum drain current of 6 A ensures stable operation under normal operating conditions, providing reliability in the circuit.

No. of Terminals: 8

Having 8 terminals allows for easy connection and integration of the FET into the circuit, providing versatility in design options.

Maximum Power Dissipation (Abs): 2 W

The maximum power dissipation of 2 W allows the FET to handle heat effectively and maintain stable operation in high-power applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for high-density mounting, suitable for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and efficiency in power management, making this FET a reliable choice for various applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C ensures the FET can withstand elevated temperatures and operate reliably in harsh environments.

Transistor Element Material: SILICON

Silicon material provides excellent switching characteristics and reliability, making the FET suitable for a wide range of applications requiring high performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers good solderability and corrosion resistance, ensuring reliable connections during the assembly process.

Maximum Drain-Source On Resistance: 0.032 ohm

The low drain-source on-resistance allows for efficient power handling and minimal voltage drop across the FET, improving overall system performance.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design and allows for versatile connection options in different applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds at peak temperature simplifies the assembly process and reduces the risk of damage to the FET during soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and reliability of connections during the assembly process.

Technical Specifications

Power Field Effect Transistors (FET) FDS6975 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

6 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS6975 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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