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FDMS8460

Onsemi

FDMS8460 by Onsemi

FDMS8460 by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 160A IDM. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has 0.0022 ohm Drain-Source On Resistance and can handle up to 104W power dissipation.

Median Price

$1.542

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 2,899 parts In-Stock

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$2.190

100+ parts

$1.130

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$1.020

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2,899

$2.190

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$1.020

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Mouser Electronics

USA . 93 parts In-Stock

1+ parts

$2.200

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$0.986

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$0.814

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93

$2.200

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$0.814

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DigiKey

USA . 11,134 parts In-Stock

1+ parts

$2.350

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$1.020

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$0.747

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11,134

$2.350

$1.020

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Flip Electronics (Authorized)

USA . 45,000 parts In-Stock

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Farnell

UK . 4,949 parts In-Stock

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$1.180

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$1.060

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$1.000

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$1.180

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$1.000

Element14

Singapore . 4,784 parts In-Stock

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$1.813

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$1.636

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4,784

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$1.813

$1.636

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Arrow

USA . 3,000 parts In-Stock

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$0.746

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$0.746

Verical

USA . 3,000 parts In-Stock

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$0.748

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$0.748

Chip1Stop

Japan . 3,000 parts In-Stock

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$1.270

3,000

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$1.270

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$1.452

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100

$1.452

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TME

Poland . 2,994 parts In-Stock

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$2.010

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Digiode

USA . 985 parts In-Stock

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$2.138

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IBS Electronics

USA . 2,994 parts In-Stock

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$3.548

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$2.104

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2,994

$3.548

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Maritex

Poland . 2,358 parts In-Stock

1+ parts

$3.667

100+ parts

$2.148

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$1.780

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2,358

$3.667

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$1.780

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Flip Electronics

USA . 72,000 parts In-Stock

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Chip Stock

USA . 16,400 parts In-Stock

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Sensible Micro Corp

USA . 12,000 parts In-Stock

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Vyrian

USA . 10,501 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,424 parts In-Stock

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Bristol Electronics

USA . 896 parts In-Stock

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ABC Electronics Ltd.

UK . 360 parts In-Stock

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Semi Source

USA . 108 parts In-Stock

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Electronics Depot

USA . 13 parts In-Stock

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Speed Components Ltd

Israel . 4 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,481 parts In-Stock

1+ parts

$1.080

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$1.080

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Corohmni

South Africa . 78 parts In-Stock

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$1.180

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78

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Argo Parts USA

USA . 4,840 parts In-Stock

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$1.452

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Netroflash

USA . 500 parts In-Stock

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$1.452

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Corphita

USA . 1,241 parts In-Stock

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Continental Prestige Electronics

USA . 7,241 parts In-Stock

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$2.160

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$1.560

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$1.040

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$2.160

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Microchip USA

USA . 8,508 parts In-Stock

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$8.637

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Perfect Parts

USA . 52,174 parts In-Stock

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Lixinc

USA . 14,129 parts In-Stock

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SupplyDigital Components

Austria . 8,090 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 5,498 parts In-Stock

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Kulean Microsystems

USA . 3,909 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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TANS Electronics

Latvia . 2,865 parts In-Stock

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Supply Digital

USA . 2,721 parts In-Stock

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Problanco Electronics

Mexico . 926 parts In-Stock

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Kepictronics

USA . 466 parts In-Stock

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UHIMA Technologies

Türkiye . 262 parts In-Stock

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Authorized Procurement Solutions

USA . 150 parts In-Stock

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Futuretech Components

Singapore . 95 parts In-Stock

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Overview

Unleash the power of the FDMS8460 by Onsemi, a top-of-the-line N-CHANNEL Power Field Effect Transistor (FET) that offers unmatched quality and reliability. Built with cutting-edge technology and manufactured by Onsemi, a trusted industry leader, this FET is perfect for switching applications where high performance is essential. With a minimum DS breakdown voltage of 40V and a maximum pulsing drain current of 160A, the FDMS8460 delivers exceptional power and efficiency. Say goodbye to overheating and hello to seamless operation with this innovative solution. Experience the difference with the FDMS8460 from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components, ensuring durability and longevity.

Polarity or Channel Type: N-CHANNEL

Suitable for various electrical applications, offering versatility and reliability.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor.

Transistor Application: SWITCHING

Efficiently controls the flow of current, making it ideal for switching applications.

Surface Mount: YES

Easily mounted on PCBs, enabling streamlined manufacturing processes.

Minimum DS Breakdown Voltage: 40 V

Can handle high voltages, ensuring reliable performance in various circuits.

Maximum Pulsed Drain Current (IDM): 160 A

Capable of handling high current spikes, making it suitable for power applications.

Avalanche Energy Rating (EAS): 864 mJ

Provides protection against energy spikes, enhancing the reliability of the product.

Maximum Power Dissipation (Abs): 104 W

Efficiently dissipates heat, allowing the transistor to operate at high power levels.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, ensuring stability in various operating conditions.

Technical Specifications

Power Field Effect Transistors (FET) FDMS8460 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

864 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

49 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.0022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDMS8460 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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