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FDMS5362L-F085

Onsemi

FDMS5362L-F085 by Onsemi

FDMS5362L-F085 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 17.6A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 0.042 ohm On Resistance, and operates in ENHANCEMENT MODE. This SMALL OUTLINE transistor has a max power dissipation of 41.7W and can withstand temperatures up to 175 °C.

Median Price

$0.515

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 40,000 parts In-Stock

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Rochester

USA . 526 parts In-Stock

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$0.515

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$0.428

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$0.381

526

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$0.515

$0.428

$0.381

Distributors (In-Stock)

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Digiode

USA . 2,227 parts In-Stock

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$0.401

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$0.401

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Vyrian

USA . 2,932 parts In-Stock

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$0.422

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Flip Electronics

USA . 40,000 parts In-Stock

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Prism Electronics

USA . 171 parts In-Stock

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Corphita

USA . 948 parts In-Stock

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$0.380

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948

$0.380

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Corohmni

South Africa . 351 parts In-Stock

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$0.422

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$0.422

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Component Stockers USA

USA . 337 parts In-Stock

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$0.430

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$0.410

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Native Components

USA . 90 parts In-Stock

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$20.500

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$20.500

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Northwest PG Solutions

USA . 1,512 parts In-Stock

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$22.550

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$20.295

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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TANS Electronics

Latvia . 6,608 parts In-Stock

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Kulean Microsystems

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QUARKTWIN TECHNOLOGY LTD

USA . 5,377 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Problanco Electronics

Mexico . 749 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 557 parts In-Stock

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SupplyDigital Components

Austria . 94 parts In-Stock

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Overview

Experience the seamless power management with the FDMS5362L-F085 by Onsemi, a leading manufacturer in the industry. Designed for high performance in switching applications, this N-channel Power FET offers reliability and efficiency like no other. With a maximum drain current of 17.6 A and an avalanche energy rating of 32 mJ, this transistor is your go-to solution for power control needs. Trust Onsemi to deliver quality products that exceed expectations. Elevate your projects with the FDMS5362L-F085 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher carrier mobility and lower on-resistance, making them suitable for high performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the circuitry from reverse voltage spikes and ensures reliable operation.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control the flow of current in electronic circuits.

Surface Mount: YES

Surface mount capability enables easy integration onto circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle higher voltage levels without breakdown, ensuring reliability in high voltage applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the current flow and can be easily turned on and off, making them ideal for switching applications.

Maximum Drain Current (Abs) (ID): 17.6 A

The high maximum drain current rating allows the FET to handle large currents, making it suitable for high power applications.

Maximum Power Dissipation (Abs): 41.7 W

With a high maximum power dissipation rating, this FET can handle significant power levels without overheating, ensuring reliable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low on-resistance, making this FET suitable for high performance applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature rating ensures reliable operation even in high temperature environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and ensures secure electrical connections.

Technical Specifications

Power Field Effect Transistors (FET) FDMS5362L-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

32 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

17.6 A

Maximum Drain Current (ID):

17.6 A

Maximum Drain-Source On Resistance:

.042 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDMS5362L-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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