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FDMC6688P

Onsemi

FDMC6688P by Onsemi

FDMC6688P by Onsemi is a P-CHANNEL Power FET with 20V DS Breakdown Voltage, 226A IDM, and 0.0065 ohm RDS(ON). Ideal for SWITCHING applications, this ENHANCEMENT MODE transistor features METAL-OXIDE SEMICONDUCTOR tech in a SQUARE package with NO LEAD terminals.

Median Price

$0.570

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 41,244 parts In-Stock

1+ parts

-

100+ parts

$0.559

1k+ parts

$0.464

10k+ parts

$0.414

41,244

-

$0.559

$0.464

$0.414

Verical

USA . 11,150 parts In-Stock

1+ parts

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$0.581

10k+ parts

$0.517

11,150

-

-

$0.581

$0.517

Distributors (In-Stock)

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Digiode

USA . 2,272 parts In-Stock

1+ parts

$0.571

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2,272

$0.571

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Nova Conductors

Japan . 10 parts In-Stock

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$0.623

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10

$0.623

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Chip Stock

USA . 72,000 parts In-Stock

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Vyrian

USA . 29,060 parts In-Stock

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29,060

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SPM Sales

USA . 1,506 parts In-Stock

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1,506

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Distributors (Availability)

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Corphita

USA . 883 parts In-Stock

1+ parts

$0.541

100+ parts

-

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883

$0.541

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Corohmni

South Africa . 329 parts In-Stock

1+ parts

$0.601

100+ parts

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329

$0.601

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Continental Prestige Electronics

USA . 3,261 parts In-Stock

1+ parts

$0.623

100+ parts

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$0.610

3,261

$0.623

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$0.610

Argo Parts USA

USA . 2,834 parts In-Stock

1+ parts

$0.623

100+ parts

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$0.604

2,834

$0.623

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$0.604

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.623

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2,000

$0.623

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Ampacity Inc.

Singapore . 29,023 parts In-Stock

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$1.110

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29,023

$1.110

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Aztec Data Supply Inc.

USA . 2,812 parts In-Stock

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$1.820

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2,812

$1.820

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Lixinc

USA . 14,337 parts In-Stock

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14,337

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SupplyDigital Components

Austria . 6,861 parts In-Stock

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6,861

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TANS Electronics

Latvia . 5,508 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 4,649 parts In-Stock

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Kepictronics

USA . 3,155 parts In-Stock

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Problanco Electronics

Mexico . 2,254 parts In-Stock

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Kulean Microsystems

USA . 1,558 parts In-Stock

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Supply Digital

USA . 1,301 parts In-Stock

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1,301

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UHIMA Technologies

Türkiye . 931 parts In-Stock

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931

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Overview

Unleash the power of innovation with the FDMC6688P by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that offer unparalleled performance and reliability. The FDMC6688P is perfect for a variety of switching applications, providing enhanced efficiency and control. With its single configuration and built-in diode, this P-CHANNEL transistor is designed to exceed expectations. Embrace the future of technology with Onsemi and experience the value and benefits that the FDMC6688P has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the transistor durable and resistant to environmental factors, ensuring a long lifespan.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are easy to use in circuits and have lower leakage current compared to N-channel transistors, making this product an efficient choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, enhancing the overall functionality of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor allows for efficient control of current flow, making it ideal for use in various electronic devices.

Surface Mount: YES

Being surface mountable makes it easy to integrate this transistor into compact circuit designs, saving space and simplifying manufacturing processes.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle high voltage applications, providing reliability in demanding operating conditions.

Package Shape: SQUARE

The square package shape allows for easy placement on circuit boards and makes it suitable for applications where space is a concern.

Terminal Form: NO LEAD

The no-lead terminal form simplifies installation and reduces the risk of lead contamination, contributing to a safer and cleaner manufacturing process.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode means the transistor can be turned on and off easily, offering efficient and precise control in switching applications.

Maximum Pulsed Drain Current (IDM): 226 A

The high maximum pulsed drain current rating of 226A allows this transistor to handle peak current demands, making it suitable for high-power applications.

No. of Terminals: 5

The 5-terminal configuration provides additional flexibility in circuit design and allows for more advanced functionality in electronic systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and offers a compact and efficient solution for integrating this transistor into electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Using metal-oxide semiconductor technology ensures high performance, low power consumption, and reliability in various operating conditions, making this product a reliable choice.

Transistor Element Material: SILICON

Silicon-based transistor elements provide high efficiency and performance, making this transistor suitable for various applications where reliability is crucial.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers good electrical conductivity and solderability, ensuring a reliable connection and easy assembly in electronic circuits.

Maximum Drain Current (ID): 14 A

With a maximum drain current rating of 14A, this transistor can handle moderate power loads, making it suitable for a wide range of electronic applications.

Maximum Drain-Source On Resistance: 0.0065 ohm

The low drain-source on resistance of 0.0065 ohms minimizes power loss and heat generation, ensuring efficient operation in high-current applications.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit layout and allows for easy connection to other components, enhancing the overall functionality of the transistor.

Case Connection: DRAIN

The drain case connection simplifies installation and ensures proper grounding, improving the overall performance and reliability of the transistor.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for reliable soldering during manufacturing processes, ensuring a secure and durable connection.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this transistor can withstand high-temperature soldering processes, making it suitable for lead-free assembly techniques.

Technical Specifications

Power Field Effect Transistors (FET) FDMC6688P attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.0065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MO-240BA

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

226 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDMC6688P Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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