Loading...

FDD8N50NZTM

Onsemi

FDD8N50NZTM by Onsemi

FDD8N50NZTM by Onsemi is a N-CHANNEL Power FET with 500V DS Breakdown Voltage and 26A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.85 ohm RDS(on), and 287mJ EAS rating. Suitable for surface mount with GULL WING terminals, it operates in ENHANCEMENT MODE up to 150°C.

Median Price

$0.863

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 303 parts In-Stock

1+ parts

$0.655

100+ parts

$0.616

1k+ parts

$0.557

10k+ parts

-

303

$0.655

$0.616

$0.557

-

Farnell

UK . 18 parts In-Stock

1+ parts

$0.863

100+ parts

-

1k+ parts

-

10k+ parts

-

18

$0.863

-

-

-

Adafruit Industries

USA . 60 parts In-Stock

1+ parts

$1.183

100+ parts

$1.124

1k+ parts

$1.124

10k+ parts

-

60

$1.183

$1.124

$1.124

-

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,736 parts In-Stock

1+ parts

$0.622

100+ parts

-

1k+ parts

-

10k+ parts

-

2,736

$0.622

-

-

-

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$1.126

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$1.126

-

-

-

Chip Stock

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Elcom Components

USA . 330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

330

-

-

-

-

Vyrian

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 461 parts In-Stock

1+ parts

$0.560

100+ parts

$0.546

1k+ parts

$0.543

10k+ parts

-

461

$0.560

$0.546

$0.543

-

Ampacity Inc.

Singapore . 144 parts In-Stock

1+ parts

$0.560

100+ parts

-

1k+ parts

-

10k+ parts

-

144

$0.560

-

-

-

Corphita

USA . 2,432 parts In-Stock

1+ parts

$0.590

100+ parts

-

1k+ parts

-

10k+ parts

-

2,432

$0.590

-

-

-

Corohmni

South Africa . 68 parts In-Stock

1+ parts

$0.655

100+ parts

-

1k+ parts

-

10k+ parts

-

68

$0.655

-

-

-

Argo Parts USA

USA . 580 parts In-Stock

1+ parts

$0.766

100+ parts

-

1k+ parts

-

10k+ parts

-

580

$0.766

-

-

-

Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$1.183

100+ parts

$1.124

1k+ parts

$1.124

10k+ parts

-

60

$1.183

$1.124

$1.124

-

Continental Prestige Electronics

USA . 38 parts In-Stock

1+ parts

$1.460

100+ parts

-

1k+ parts

-

10k+ parts

-

38

$1.460

-

-

-

Aztec Data Supply Inc.

USA . 85 parts In-Stock

1+ parts

$1.831

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$1.831

-

-

-

Microchip USA

USA . 8,567 parts In-Stock

1+ parts

$3.892

100+ parts

-

1k+ parts

-

10k+ parts

-

8,567

$3.892

-

-

-

Kulean Microsystems

USA . 7,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,875

-

-

-

-

TANS Electronics

Latvia . 5,691 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,691

-

-

-

-

Perfect Parts

USA . 5,152 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,152

-

-

-

-

SupplyDigital Components

Austria . 4,808 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,808

-

-

-

-

Problanco Electronics

Mexico . 4,198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,198

-

-

-

-

Supply Digital

USA . 2,034 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,034

-

-

-

-

Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

UHIMA Technologies

Türkiye . 950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

950

-

-

-

-

Overview

Unleash the power of innovation with the FDD8N50NZTM by Onsemi, a high-quality Power FET that redefines performance standards. Designed for switching applications, this N-CHANNEL transistor boasts a robust design and built-in diode for seamless operation. With a maximum DS Breakdown Voltage of 500V and a Maximum Drain Current of 6.5A, this transistor delivers unparalleled reliability and efficiency. Say goodbye to limitations and hello to endless possibilities with the FDD8N50NZTM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures long-lasting performance in various operating conditions, making it a reliable choice.

Polarity or Channel Type: N-CHANNEL

The N-channel design allows for efficient switching operations, making it suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances overall functionality, making it a convenient choice for users.

Transistor Application: SWITCHING

Specifically designed for switching applications, this FET offers high performance and reliability in controlling electrical currents.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving benefits, making it ideal for compact electronic devices.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this FET can handle high levels of electrical stress, ensuring reliable operation in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape provides versatility in installation and allows for efficient heat dissipation, improving overall performance.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering capabilities and provides mechanical strength, ensuring secure connections in various applications.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation offers precise control over the switching process, optimizing efficiency and performance.

Maximum Pulsed Drain Current (IDM): 26 A

With a high pulsed drain current rating, this FET can handle sudden surges in current, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 287 mJ

The high avalanche energy rating allows the FET to withstand sudden voltage spikes, ensuring protection against power surges.

Maximum Drain Current (Abs) (ID): 6.5 A

The high drain current rating ensures reliable and efficient operation in various circuit applications.

No. of Terminals: 2

The two-terminal design simplifies installation and reduces complexity, making it user-friendly and suitable for DIY projects.

Maximum Power Dissipation (Abs): 90 W

With a high power dissipation rating, this FET can efficiently manage heat generation, ensuring long-term reliability in operation.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for compact design layouts and ease of integration into space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers efficient performance and low power consumption, making it an energy-efficient choice.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand elevated temperatures, ensuring stable performance in harsh environments.

Transistor Element Material: SILICON

The silicon element material provides excellent electrical properties and temperature stability, ensuring reliability and longevity in operation.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances soldering capabilities and provides corrosion resistance, ensuring long-term reliability in various environments.

Maximum Drain-Source On Resistance: 0.85 ohm

With low drain-source on resistance, this FET offers efficient current flow and minimal power loss, improving overall efficiency.

Terminal Position: SINGLE

The single terminal position simplifies installation and enhances compatibility with a wide range of circuit designs, making it versatile and easy to use.

Case Connection: DRAIN

The drain case connection provides a secure grounding point, ensuring stable operation and protection against electrical faults.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this FET can withstand high-temperature soldering processes, ensuring reliable connections during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this FET can undergo high-temperature soldering processes without compromising performance, ensuring durability and reliability.

Technical Specifications

Power Field Effect Transistors (FET) FDD8N50NZTM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ESD PROTECTED

Avalanche Energy Rating (EAS):

287 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

6.5 A

Maximum Drain Current (ID):

6.5 A

Maximum Drain-Source On Resistance:

.85 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

26 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD8N50NZTM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20