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FDD8447L-F085

Onsemi

FDD8447L-F085 by Onsemi

FDD8447L-F085 by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 50A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0085 ohm Drain-Source Resistance, and operates in ENHANCEMENT MODE. AEC-Q101 certified, it can handle up to 65W power dissipation at temperatures ranging from -55 to 175 °C.

Median Price

$0.503

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,254 parts In-Stock

1+ parts

-

100+ parts

$0.503

1k+ parts

$0.418

10k+ parts

$0.372

3,254

-

$0.503

$0.418

$0.372

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,628 parts In-Stock

1+ parts

$0.380

100+ parts

-

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2,628

$0.380

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Nova Conductors

Japan . 955 parts In-Stock

1+ parts

$1.021

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955

$1.021

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Chip Stock

USA . 44,000 parts In-Stock

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44,000

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Vyrian

USA . 3,709 parts In-Stock

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3,709

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PC Components Company LLC

USA . 45 parts In-Stock

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45

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Bristol Electronics

USA . 45 parts In-Stock

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45

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Prism Electronics

USA . 28 parts In-Stock

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28

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Distributors (Availability)

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Semicontronic

India . 28,566 parts In-Stock

1+ parts

$0.340

100+ parts

$0.332

1k+ parts

$0.330

10k+ parts

-

28,566

$0.340

$0.332

$0.330

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Ampacity Inc.

Singapore . 18,998 parts In-Stock

1+ parts

$0.340

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18,998

$0.340

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Corphita

USA . 2,173 parts In-Stock

1+ parts

$0.360

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2,173

$0.360

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Continental Prestige Electronics

USA . 8,567 parts In-Stock

1+ parts

$1.021

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$1.001

8,567

$1.021

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$1.001

Argo Parts USA

USA . 6,398 parts In-Stock

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$1.021

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6,398

$1.021

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Netroflash

USA . 150 parts In-Stock

1+ parts

$1.021

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$0.970

10k+ parts

$0.950

150

$1.021

-

$0.970

$0.950

Aztec Data Supply Inc.

USA . 690 parts In-Stock

1+ parts

$1.115

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690

$1.115

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Corohmni

South Africa . 757 parts In-Stock

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$1.701

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757

$1.701

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AZTECH Wire

Italy . 1,177 parts In-Stock

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$15.380

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Perfect Parts

USA . 14,103 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

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TANS Electronics

Latvia . 3,598 parts In-Stock

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Supply Digital

USA . 2,884 parts In-Stock

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Kulean Microsystems

USA . 2,348 parts In-Stock

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Problanco Electronics

Mexico . 599 parts In-Stock

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UHIMA Technologies

Türkiye . 544 parts In-Stock

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SupplyDigital Components

Austria . 381 parts In-Stock

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Overview

Power up your applications with the FDD8447L-F085 by Onsemi, a high-quality Power Field Effect Transistor (FET) that offers unmatched performance and reliability. With its N-CHANNEL configuration, built-in diode, and enhancement mode operation, this transistor is perfect for switching applications. Its small outline package and matte tin terminal finish make installation a breeze. Trust Onsemi's expertise in semiconductor technology to deliver top-notch products that meet AEC-Q101 standards. Experience superior power management and efficiency with the FDD8447L-F085 - the perfect choice for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, which is ideal for portable applications.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage of 40V, this FET can handle higher voltages without breaking down, ensuring reliable operation in a variety of circuits.

Maximum Drain Current (Abs) (ID): 50 A

The high drain current rating of 50A allows this FET to handle large current loads, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 65 W

With a maximum power dissipation of 65W, this FET can effectively dissipate heat and operate at higher power levels without overheating.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C ensures that this FET can operate reliably in high-temperature environments without performance degradation.

Maximum Drain-Source On Resistance: 0.0085 ohm

The low on-resistance of 0.0085 ohm minimizes power loss and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD8447L-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

40 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain-Source On Resistance:

.0085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD8447L-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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