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FDD8444

Onsemi

FDD8444 by Onsemi

FDD8444 by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 17.5A Drain Current. It is used for SWITCHING applications, operates in ENHANCEMENT MODE, and has a max power dissipation of 227W. The transistor features GULL WING terminals, METAL-OXIDE SEMICONDUCTOR technology, and can withstand temperatures up to 175°C.

Median Price

$0.922

Lifecycle Status

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22

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1k+

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Chip1Stop

Japan . 4 parts In-Stock

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$0.865

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$0.865

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Mouser Electronics

USA . 5,714 parts In-Stock

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$2.220

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$0.955

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$0.769

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Avnet

USA . 5,000 parts In-Stock

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Arrow

USA . 2,500 parts In-Stock

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$0.586

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$0.586

Verical

USA . 2,500 parts In-Stock

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$0.979

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Rochester

USA . 160 parts In-Stock

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$0.726

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$0.603

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$0.537

160

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$0.726

$0.603

$0.537

DigiKey

USA . 160 parts In-Stock

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$1.880

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160

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$1.880

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Digiode

USA . 2,189 parts In-Stock

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$0.495

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Nova Conductors

Japan . 79 parts In-Stock

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$1.064

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Bristol Electronics

USA . 1,257 parts In-Stock

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$1.530

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$0.566

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$0.398

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1,257

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Chip Stock

USA . 26,000 parts In-Stock

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Flip Electronics

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Semi Source

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IBS Electronics

USA . 2,500 parts In-Stock

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$1.332

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R&J Components

USA . 1,681 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,530 parts In-Stock

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Vyrian

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Dan-Mar Components

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ACDS - Activité Composants Distribution Service

France . 852 parts In-Stock

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Prism Electronics

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DigiKey Marketplace

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Technoshack Inc.

Canada . 12 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,662 parts In-Stock

1+ parts

$0.443

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$0.432

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$0.430

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1,662

$0.443

$0.432

$0.430

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Ampacity Inc.

Singapore . 1,621 parts In-Stock

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$0.443

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Corphita

USA . 1,681 parts In-Stock

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$0.469

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Corohmni

South Africa . 317 parts In-Stock

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$0.521

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Aztec Data Supply Inc.

USA . 187 parts In-Stock

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$1.033

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Aranea Global

USA . 50 parts In-Stock

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$1.042

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$1.001

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Argo Parts USA

USA . 3,461 parts In-Stock

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Continental Prestige Electronics

USA . 2,908 parts In-Stock

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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Perfect Parts

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

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Kulean Microsystems

USA . 6,412 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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Supply Digital

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TANS Electronics

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SupplyDigital Components

Austria . 1,651 parts In-Stock

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UHIMA Technologies

Türkiye . 784 parts In-Stock

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Overview

Power up your electronics with the FDD8444 by Onsemi, a top-quality Power Field Effect Transistor designed for optimal performance in switching applications. With its N-Channel configuration and built-in diode, this transistor offers enhanced efficiency and reliability. Whether you're working on industrial machinery or consumer electronics, this transistor delivers the power you need with a maximum drain current of 155A and maximum power dissipation of 227W. Trust Onsemi's expertise in semiconductor technology to bring you a dependable product that exceeds expectations. Elevate your projects with the FDD8444 and experience the difference in performance and quality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used for high-performance applications due to their lower on-state resistance and higher efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse polarity, making this FET suitable for various applications.

Transistor Application: SWITCHING

This FET is specifically designed for switching applications, ensuring reliable and efficient operation in various circuits.

Avalanche Energy Rating (EAS): 535 mJ

With a high avalanche energy rating, this FET can withstand surge currents and voltage spikes, making it ideal for harsh operating conditions.

Maximum Drain Current (Abs) (ID): 17.5 A

The high maximum drain current rating allows for reliable operation in high-power applications without the risk of overheating or failure.

Maximum Power Dissipation (Abs): 227 W

The high power dissipation rating ensures that the FET can handle high levels of power without compromising performance or reliability.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can handle high-temperature environments without experiencing thermal shutdown or degradation.

Maximum Drain Current (ID): 155 A

The high maximum drain current rating of 155 A allows for reliable performance in high-current applications, ensuring stable operation under load.

Maximum Drain-Source On Resistance: 5.2 ohm

The low drain-source on resistance of 5.2 ohms minimizes power loss and improves efficiency, making this FET suitable for high-power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD8444 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

535 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

17.5 A

Maximum Drain Current (ID):

155 A

Maximum Drain-Source On Resistance:

5.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD8444 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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