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FDD8444-F085

Onsemi

FDD8444-F085 by Onsemi

FDD8444-F085 by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 145A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0052 ohm Drain-Source Resistance, and operates in ENHANCEMENT MODE. Suitable for high-power circuit designs requiring efficient switching capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,210 parts In-Stock

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Digiode

USA . 1,688 parts In-Stock

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1,688

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Distributors (Availability)

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Component Stockers USA

USA . 248 parts In-Stock

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$99.990

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$99.990

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Native Components

USA . 60 parts In-Stock

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$269.085

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$263.703

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$261.012

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$258.322

60

$269.085

$263.703

$261.012

$258.322

Northwest PG Solutions

USA . 511 parts In-Stock

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$295.993

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511

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,735 parts In-Stock

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Perfect Parts

USA . 20,571 parts In-Stock

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Problanco Electronics

Mexico . 4,543 parts In-Stock

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TANS Electronics

Latvia . 4,372 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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SupplyDigital Components

Austria . 2,466 parts In-Stock

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Kulean Microsystems

USA . 1,227 parts In-Stock

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Corphita

USA . 1,204 parts In-Stock

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Supply Digital

USA . 496 parts In-Stock

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Corohmni

South Africa . 345 parts In-Stock

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UHIMA Technologies

Türkiye . 180 parts In-Stock

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Overview

Unlock the full potential of your power applications with the FDD8444-F085 by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor (FET) offers unparalleled performance and reliability. Whether you're looking to enhance your switching systems or optimize your power distribution, this transistor is designed to exceed your expectations. With a high DS Breakdown Voltage and a robust construction, this product ensures seamless operation even in demanding environments. Trust Onsemi's reputation for quality and innovation to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and allows for cost-effective manufacturing.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode allows for easier design integration and protection against voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in such scenarios.

Surface Mount: YES

Allows for easy PCB assembly and space-saving in compact electronic devices.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this FET can handle higher voltages without failure.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and soldering on the PCB.

Maximum Drain Current (Abs) (ID): 145 A

Capable of handling high current loads, making it suitable for power applications.

Maximum Power Dissipation (Abs): 153 W

Can dissipate significant amounts of power without overheating, ensuring reliability in operation.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without performance degradation, suitable for harsh environments.

Maximum Drain-Source On Resistance: 0.0052 ohm

Low ON resistance results in minimal power loss and higher efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD8444-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

535 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

145 A

Maximum Drain-Source On Resistance:

.0052 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD8444-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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