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FDD3682-F085

Onsemi

FDD3682-F085 by Onsemi

FDD3682-F085 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 32A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, operates in ENHANCEMENT MODE, and has a max power dissipation of 95W.

Median Price

$0.868

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,010 parts In-Stock

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$0.611

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Vyrian

USA . 6,492 parts In-Stock

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Digiode

USA . 1,886 parts In-Stock

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Chip Stock

USA . 795 parts In-Stock

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795

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Classic Components Corporation

USA . 277 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 187 parts In-Stock

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Bristol Electronics

USA . 187 parts In-Stock

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$1.125

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$0.675

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187

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$1.125

$0.675

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Dan-Mar Components

USA . 187 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$0.599

100+ parts

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$0.575

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500

$0.599

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$0.575

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Corohmni

South Africa . 272 parts In-Stock

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$0.599

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272

$0.599

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Netroflash

USA . 100 parts In-Stock

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$0.611

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$0.599

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100

$0.611

$0.599

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Ampacity Inc.

Singapore . 834 parts In-Stock

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$3.050

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834

$3.050

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AZTECH Wire

Italy . 716 parts In-Stock

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$6.248

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,621 parts In-Stock

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TANS Electronics

Latvia . 6,074 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

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Kulean Microsystems

USA . 2,985 parts In-Stock

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Problanco Electronics

Mexico . 2,635 parts In-Stock

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Supply Digital

USA . 1,632 parts In-Stock

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Corphita

USA . 864 parts In-Stock

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Perfect Parts

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SupplyDigital Components

Austria . 529 parts In-Stock

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UHIMA Technologies

Türkiye . 316 parts In-Stock

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Overview

Upgrade your power management system with the FDD3682-F085 by Onsemi. Manufactured with high-quality materials and advanced technology, this N-channel Power FET offers reliable performance in various switching applications. With a built-in diode and an impressive 100V minimum DS breakdown voltage, this transistor ensures efficient operation and enhanced durability. Say goodbye to overheating issues as this FET boasts a maximum power dissipation of 95W and a low on-resistance of 0.036 ohm. Trust Onsemi to deliver top-notch components that provide value, efficiency, and peace of mind for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring long-lasting durability.

Polarity or Channel Type: N-CHANNEL

Offers efficient performance and low resistance, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by including a built-in diode for reverse voltage protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast and reliable performance.

Surface Mount: YES

Enables easy and convenient installation on circuit boards.

Minimum DS Breakdown Voltage: 100 V

Can handle high voltages, ensuring reliable operation in demanding conditions.

Package Shape: RECTANGULAR

Facilitates efficient placement and mounting in various electronic devices.

Terminal Form: GULL WING

Allows for easy soldering and connection to circuit boards, ensuring secure electrical connections.

Operating Mode: ENHANCEMENT MODE

Provides precise control over the transistor's operation, enhancing performance in switching applications.

Avalanche Energy Rating (EAS): 55 mJ

Capable of handling sudden spikes in voltage without damage, ensuring reliability in transient conditions.

Maximum Drain Current (Abs) (ID): 32 A

Supports high current flow, making it suitable for power applications that require robust performance.

Maximum Power Dissipation (Abs): 95 W

Can handle high power levels without overheating, ensuring stable operation under heavy loads.

Package Style (Meter): SMALL OUTLINE

Compact size allows for space-efficient integration into electronic devices with limited space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and low power consumption, making it ideal for energy-efficient applications.

Maximum Operating Temperature: 175 °C

Can operate reliably in high-temperature environments without performance degradation.

Transistor Element Material: SILICON

Provides high performance and reliability, ensuring consistent operation over the product's lifespan.

Minimum Operating Temperature: -55 °C

Can withstand low temperatures, making it suitable for a wide range of operating environments.

Terminal Finish: MATTE TIN

Enhances solderability and ensures reliable connections for long-term performance.

Maximum Drain Current (ID): 5.5 A

Can handle moderate current levels, suitable for a variety of electronic applications.

Maximum Drain-Source On Resistance: 0.036 ohm

Provides low resistance for efficient power transmission, reducing energy losses.

Terminal Position: SINGLE

Simplifies installation and connection to other components in the circuit.

Case Connection: DRAIN

Optimal connection for drain terminal, ensuring efficient power flow in the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Ideal reflow temperature for soldering, ensuring a strong and reliable bond.

Reference Standard: AEC-Q101

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD3682-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

55 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

32 A

Maximum Drain Current (ID):

5.5 A

Maximum Drain-Source On Resistance:

.036 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD3682-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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