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FDD3672

Onsemi

FDD3672 by Onsemi

FDD3672 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 6.5A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 0.028 ohm On Resistance, and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, this transistor has a max power dissipation of 135W in a RECTANGULAR package style.

Median Price

$1.822

Lifecycle Status

Suppliers In-Stock

33

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,129 parts In-Stock

1+ parts

$1.187

100+ parts

$0.852

1k+ parts

$0.733

10k+ parts

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1,129

$1.187

$0.852

$0.733

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Element14

Singapore . 2,734 parts In-Stock

1+ parts

$1.728

100+ parts

$1.142

1k+ parts

$0.964

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2,734

$1.728

$1.142

$0.964

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Farnell

UK . 2,734 parts In-Stock

1+ parts

$1.915

100+ parts

$1.106

1k+ parts

$0.936

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2,734

$1.915

$1.106

$0.936

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Mouser Electronics

USA . 2,460 parts In-Stock

1+ parts

$2.190

100+ parts

$1.030

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$0.836

10k+ parts

$0.780

2,460

$2.190

$1.030

$0.836

$0.780

Newark

USA . 2,362 parts In-Stock

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$2.360

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$1.400

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$2.360

$1.400

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DigiKey

USA . 11,752 parts In-Stock

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$2.420

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$1.062

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$0.835

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$0.682

11,752

$2.420

$1.062

$0.835

$0.682

Chip1Stop

Japan . 1,250 parts In-Stock

1+ parts

$5.520

100+ parts

$2.310

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$1.490

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1,250

$5.520

$2.310

$1.490

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Flip Electronics (Authorized)

USA . 27,500 parts In-Stock

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Verical

USA . 2,750 parts In-Stock

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$0.959

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$0.834

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$0.793

2,750

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$0.959

$0.834

$0.793

Master Electronics

USA . 2,750 parts In-Stock

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$0.815

1k+ parts

$0.709

10k+ parts

$0.664

2,750

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$0.815

$0.709

$0.664

Rochester

USA . 1,750 parts In-Stock

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$0.927

1k+ parts

$0.769

10k+ parts

$0.686

1,750

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$0.927

$0.769

$0.686

Distributors (In-Stock)

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Greenchips

USA . 9 parts In-Stock

1+ parts

$0.627

100+ parts

$0.627

1k+ parts

$0.627

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$0.627

9

$0.627

$0.627

$0.627

$0.627

Nova Conductors

Japan . 50 parts In-Stock

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$0.871

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50

$0.871

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Digiode

USA . 206 parts In-Stock

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$1.642

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206

$1.642

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TME

Poland . 1,535 parts In-Stock

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$1.970

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$0.960

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1,535

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Chip Stock

USA . 167,500 parts In-Stock

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Flip Electronics

USA . 27,500 parts In-Stock

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Vyrian

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IBS Electronics

USA . 2,750 parts In-Stock

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$1.143

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$0.994

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$0.931

2,750

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$1.143

$0.994

$0.931

Inventory MP

USA . 2,700 parts In-Stock

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Bristol Electronics

USA . 2,700 parts In-Stock

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Sensible Micro Corp

USA . 1,964 parts In-Stock

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NAC Semi

USA . 1,082 parts In-Stock

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Prism Electronics

USA . 1,040 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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ComSIT Distribution GmbH

Germany . 836 parts In-Stock

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Bas Electronics GmbH & Co. KG

Germany . 263 parts In-Stock

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PC Components Company LLC

USA . 54 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

USA . 41 parts In-Stock

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Sunrise Surplus Inc.

USA . 9 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 9 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 6,309 parts In-Stock

1+ parts

$0.570

100+ parts

$0.556

1k+ parts

$0.553

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6,309

$0.570

$0.556

$0.553

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Ampacity Inc.

Singapore . 6,157 parts In-Stock

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$0.570

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$0.570

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Corohmni

South Africa . 178 parts In-Stock

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$0.627

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Argo Parts USA

USA . 3,028 parts In-Stock

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$0.871

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3,028

$0.871

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Continental Prestige Electronics

USA . 1,179 parts In-Stock

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$0.871

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$0.853

1,179

$0.871

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$0.853

Aztec Data Supply Inc.

USA . 1,863 parts In-Stock

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$1.230

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$1.230

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Corphita

USA . 3,129 parts In-Stock

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$1.555

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3,129

$1.555

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Andel Nordic

Denmark . 3,835 parts In-Stock

1+ parts

$1.674

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$1.607

10k+ parts

$1.607

3,835

$1.674

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$1.607

Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Perfect Parts

USA . 41,004 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,123 parts In-Stock

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Infinite Electronics LLP (Excess)

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Microchip USA

USA . 9,618 parts In-Stock

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GreenTree Electronics

Israel . 7,500 parts In-Stock

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TANS Electronics

Latvia . 6,107 parts In-Stock

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Lixinc

USA . 6,066 parts In-Stock

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Kulean Microsystems

USA . 4,649 parts In-Stock

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SupplyDigital Components

Austria . 4,232 parts In-Stock

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Authorized Procurement Solutions

USA . 2,900 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Problanco Electronics

Mexico . 996 parts In-Stock

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Supply Digital

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Netroflash

USA . 500 parts In-Stock

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$0.853

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$0.827

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$0.810

500

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$0.853

$0.827

$0.810

S.R.D Solutions

India . 500 parts In-Stock

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Kepictronics

USA . 480 parts In-Stock

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ChipstoGo Electronic ltd

UK . 273 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 200 parts In-Stock

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UHIMA Technologies

Türkiye . 49 parts In-Stock

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Overview

Unleash the power of innovation with the FDD3672 by Onsemi. This high-quality Power Field Effect Transistor (FET) offers customers unparalleled performance and reliability. With its single configuration and built-in diode, this N-channel transistor is perfect for switching applications. Whether you're looking to optimize energy efficiency or improve circuit performance, this product delivers exceptional value. Trust in Onsemi's expertise and elevate your projects with the FDD3672.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package makes the transistor lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility, which can result in better performance and efficiency in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient operation in such scenarios.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle high voltage applications.

Avalanche Energy Rating (EAS): 120 mJ

The high avalanche energy rating of 120 mJ indicates that the FET can handle surge currents and voltage spikes effectively.

Maximum Drain Current (Abs) (ID): 6.5 A

With a high maximum drain current of 6.5A, this FET can handle high current loads efficiently.

Maximum Power Dissipation (Abs): 135 W

The high maximum power dissipation of 135W indicates that the FET can handle power spikes and operate reliably under heavy loads.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can operate in high temperature environments without degrading performance.

Maximum Drain-Source On Resistance: 0.028 ohm

The low drain-source on resistance of 0.028 ohm results in minimal power loss and higher efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD3672 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

120 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

6.5 A

Maximum Drain Current (ID):

6.5 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD3672 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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