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FDC8601

Onsemi

FDC8601 by Onsemi

FDC8601 by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage and 2.7A max drain current, ideal for switching applications. It features a built-in diode, operates in enhancement mode, and has a max power dissipation of 1.6W. The small outline package with gull wing terminals makes it suitable for surface mount designs at up to 150°C operating temperature.

Median Price

$0.999

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 7,764 parts In-Stock

1+ parts

$2.200

100+ parts

$0.953

1k+ parts

$0.758

10k+ parts

-

7,764

$2.200

$0.953

$0.758

-

DigiKey

USA . 4,787 parts In-Stock

1+ parts

$2.200

100+ parts

$0.953

1k+ parts

$0.695

10k+ parts

-

4,787

$2.200

$0.953

$0.695

-

Rochester

USA . 9,889 parts In-Stock

1+ parts

-

100+ parts

$0.743

1k+ parts

$0.617

10k+ parts

$0.550

9,889

-

$0.743

$0.617

$0.550

RS (Exports)

UK . 8,930 parts In-Stock

1+ parts

-

100+ parts

$1.150

1k+ parts

$1.092

10k+ parts

$1.065

8,930

-

$1.150

$1.092

$1.065

Verical

USA . 6,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.771

10k+ parts

$0.687

6,331

-

-

$0.771

$0.687

Chip1Stop

Japan . 2,289 parts In-Stock

1+ parts

-

100+ parts

$0.848

1k+ parts

$0.619

10k+ parts

$0.513

2,289

-

$0.848

$0.619

$0.513

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,222 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

-

10k+ parts

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2,222

$0.550

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.636

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$0.636

-

-

-

Chip Stock

USA . 68,000 parts In-Stock

1+ parts

-

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68,000

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Flip Electronics

USA . 63,000 parts In-Stock

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63,000

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Vyrian

USA . 8,943 parts In-Stock

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8,943

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Euro-Tech

UK . 2,169 parts In-Stock

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2,169

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Cyclops Electronics Ltd

UK . 1,997 parts In-Stock

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1,997

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North Shore Components

USA . 630 parts In-Stock

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630

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,103 parts In-Stock

1+ parts

$0.492

100+ parts

-

1k+ parts

-

10k+ parts

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9,103

$0.492

-

-

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Corphita

USA . 2,438 parts In-Stock

1+ parts

$0.521

100+ parts

-

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-

10k+ parts

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2,438

$0.521

-

-

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Corohmni

South Africa . 309 parts In-Stock

1+ parts

$0.579

100+ parts

-

1k+ parts

-

10k+ parts

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309

$0.579

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.623

100+ parts

-

1k+ parts

$0.598

10k+ parts

-

100

$0.623

-

$0.598

-

Argo Parts USA

USA . 4,681 parts In-Stock

1+ parts

$0.636

100+ parts

-

1k+ parts

-

10k+ parts

$0.617

4,681

$0.636

-

-

$0.617

Aztec Data Supply Inc.

USA . 3,458 parts In-Stock

1+ parts

$1.467

100+ parts

-

1k+ parts

-

10k+ parts

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3,458

$1.467

-

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Microchip USA

USA . 9,954 parts In-Stock

1+ parts

$4.020

100+ parts

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9,954

$4.020

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Perfect Parts

USA . 21,159 parts In-Stock

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21,159

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Lixinc

USA . 16,514 parts In-Stock

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16,514

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Problanco Electronics

Mexico . 7,081 parts In-Stock

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7,081

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Supply Digital

USA . 2,892 parts In-Stock

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2,892

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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2,700

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TANS Electronics

Latvia . 2,058 parts In-Stock

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2,058

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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1,800

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SupplyDigital Components

Austria . 1,304 parts In-Stock

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1,304

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Kulean Microsystems

USA . 691 parts In-Stock

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691

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Kepictronics

USA . 200 parts In-Stock

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200

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UHIMA Technologies

Türkiye . 84 parts In-Stock

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84

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Discover the FDC8601 by Onsemi, a high-quality N-channel Small Signal Field Effect Transistor designed for switching applications. With a single configuration and built-in diode, this enhancement mode transistor offers reliable performance and efficient power dissipation in a compact rectangular package. Ideal for various electronic circuits, the FDC8601 provides a maximum drain current of 2.7 A and a minimum DS breakdown voltage of 100 V, ensuring optimal functionality. Trust Onsemi's expertise and innovation to enhance your projects with the FDC8601's advanced technology and dependable operation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are commonly used for switching applications due to their high efficiency and fast switching speeds.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protects the transistor from voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in controlling electrical circuits.

Surface Mount: YES

This feature allows for easy and compact installation on printed circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this transistor can handle high voltages without damage, increasing reliability in high-power applications.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor for easy integration into existing circuit designs.

Terminal Form: GULL WING

The gull wing terminals offer a secure connection to the circuit board, reducing the risk of disconnection and ensuring stable performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are easy to control and offer low on-resistance, making them ideal for high-efficiency switching applications.

Maximum Drain Current (Abs) (ID): 2.7 A

With a high maximum drain current, this transistor can handle heavy loads and deliver reliable performance in demanding applications.

No. of Terminals: 6

The 6 terminals provide multiple connection points for flexible circuit configurations, accommodating various circuit design requirements.

Maximum Power Dissipation (Abs): 1.6 W

This high power dissipation rating ensures the transistor can handle heat generated during operation, contributing to long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers space-saving advantages, making it suitable for compact electronic devices and applications with limited space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers high switching speeds and low power consumption, making it ideal for efficient switching applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures, ensuring stability in harsh environments.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance and reliability, making them a popular choice for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and corrosion resistance, ensuring reliable connections for long-term performance.

Maximum Drain-Source On Resistance: 0.183 ohm

The low on-resistance of this transistor reduces power losses and improves efficiency in switching applications.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit design and allows for versatile connections in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

This transistor can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliable connections during assembly processes.

Maximum Feedback Capacitance (Crss): 5 pF

The low feedback capacitance minimizes signal distortion and ensures accurate switching performance in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDC8601 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

2.7 A

Maximum Drain Current (ID):

2.7 A

Maximum Drain-Source On Resistance:

.183 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

MO-193AA

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDC8601 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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