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FDC8884

Onsemi

FDC8884 by Onsemi

FDC8884 by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a single configuration with built-in diode, GULL WING terminals, and 8A Drain Current. Operating in ENHANCEMENT MODE, it has a max power dissipation of 1.6W and can withstand temperatures up to 150 °C.

Median Price

$0.269

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2,161 parts In-Stock

1+ parts

$0.334

100+ parts

$0.172

1k+ parts

$0.133

10k+ parts

$0.113

2,161

$0.334

$0.172

$0.133

$0.113

Newark

USA . 2,161 parts In-Stock

1+ parts

$0.410

100+ parts

$0.222

1k+ parts

$0.168

10k+ parts

$0.131

2,161

$0.410

$0.222

$0.168

$0.131

Rochester

USA . 64,597 parts In-Stock

1+ parts

-

100+ parts

$0.187

1k+ parts

$0.155

10k+ parts

$0.138

64,597

-

$0.187

$0.155

$0.138

DigiKey

USA . 55,290 parts In-Stock

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$0.160

55,290

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$0.160

Flip Electronics (Authorized)

USA . 55,290 parts In-Stock

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55,290

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Verical

USA . 33,361 parts In-Stock

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$0.215

33,361

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$0.215

Element14

Singapore . 2,161 parts In-Stock

1+ parts

-

100+ parts

$0.323

1k+ parts

$0.250

10k+ parts

$0.199

2,161

-

$0.323

$0.250

$0.199

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,483 parts In-Stock

1+ parts

$0.181

100+ parts

-

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1,483

$0.181

-

-

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Vyrian

USA . 453 parts In-Stock

1+ parts

$0.191

100+ parts

-

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453

$0.191

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Flip Electronics

USA . 55,290 parts In-Stock

1+ parts

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55,290

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Chip Stock

USA . 39,000 parts In-Stock

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39,000

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Bristol Electronics

USA . 1,336 parts In-Stock

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1,336

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Distributors (Availability)

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Corphita

USA . 473 parts In-Stock

1+ parts

$0.172

100+ parts

-

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473

$0.172

-

-

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Component Stockers USA

USA . 54,980 parts In-Stock

1+ parts

$0.190

100+ parts

$0.180

1k+ parts

$0.160

10k+ parts

$0.160

54,980

$0.190

$0.180

$0.160

$0.160

Corohmni

South Africa . 283 parts In-Stock

1+ parts

$0.191

100+ parts

-

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283

$0.191

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Native Components

USA . 259 parts In-Stock

1+ parts

$0.469

100+ parts

-

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$0.450

259

$0.469

-

-

$0.450

Northwest PG Solutions

USA . 1,375 parts In-Stock

1+ parts

$0.516

100+ parts

-

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$0.455

1,375

$0.516

-

-

$0.455

Continental Prestige Electronics

USA . 2 parts In-Stock

1+ parts

$0.530

100+ parts

-

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2

$0.530

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,106 parts In-Stock

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Perfect Parts

USA . 17,506 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 4,728 parts In-Stock

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TANS Electronics

Latvia . 4,344 parts In-Stock

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Kulean Microsystems

USA . 3,602 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,595 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,730 parts In-Stock

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SupplyDigital Components

Austria . 1,346 parts In-Stock

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UHIMA Technologies

Türkiye . 893 parts In-Stock

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Supply Digital

USA . 518 parts In-Stock

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Problanco Electronics

Mexico . 160 parts In-Stock

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Formix International (Excess)

India . 1 parts In-Stock

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Overview

Elevate your electronic designs with the FDC8884 by Onsemi. Crafted with precision and quality in mind, this N-CHANNEL Small Signal Field Effect Transistor offers unparalleled performance in switching applications. With a built-in diode and a maximum drain current of 8A, this enhancement mode transistor provides reliable operation and efficient power dissipation. Whether you're working on consumer electronics or industrial equipment, the FDC8884 delivers exceptional value, benefits, and advantages that will take your projects to the next level. Experience the difference with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection for the internal components of the transistor, ensuring its durability and longevity.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have higher mobility and faster switching speeds, making them ideal for switching applications.

Minimum DS Breakdown Voltage: 30 V

With a high minimum breakdown voltage of 30V, this transistor can handle higher voltages without failure, ensuring reliability in diverse applications.

Maximum Drain Current (Abs): 8 A

The high maximum drain current of 8A allows this transistor to handle large current loads, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 1.6 W

With a maximum power dissipation of 1.6W, this transistor can effectively dissipate heat generated during operation, preventing overheating and ensuring performance stability.

Maximum Operating Temperature: 150 °C

Operating at a maximum temperature of 150 °C allows this transistor to withstand high temperature environments, making it suitable for a wide range of applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDC8884 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

6.5 A

Maximum Drain-Source On Resistance:

.023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

25 pF

JEDEC-95 Code:

MO-193AA

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDC8884 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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