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FDB9409L-F085

Onsemi

FDB9409L-F085 by Onsemi

The Onsemi FDB9409L-F085 is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 90A ID. Ideal for SWITCHING applications, it features a built-in DIODE, 94W power dissipation, and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it has a max temp of 175 °C and meets AEC-Q101 standards.

Median Price

$1.080

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 382 parts In-Stock

1+ parts

-

100+ parts

$1.080

1k+ parts

$0.896

10k+ parts

$0.799

382

-

$1.080

$0.896

$0.799

Farnell

UK . 382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.831

10k+ parts

-

382

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$0.831

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Verical

USA . 382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.688

10k+ parts

-

382

-

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$1.688

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Distributors (In-Stock)

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Digiode

USA . 2,254 parts In-Stock

1+ parts

$1.054

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2,254

$1.054

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Vyrian

USA . 6,696 parts In-Stock

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6,696

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Distributors (Availability)

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Corohmni

South Africa . 495 parts In-Stock

1+ parts

$0.831

100+ parts

-

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495

$0.831

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-

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Native Components

USA . 968 parts In-Stock

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$0.955

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-

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968

$0.955

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Corphita

USA . 727 parts In-Stock

1+ parts

$0.999

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727

$0.999

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Northwest PG Solutions

USA . 344 parts In-Stock

1+ parts

$1.050

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344

$1.050

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Component Stockers USA

USA . 501 parts In-Stock

1+ parts

$1.140

100+ parts

$1.080

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-

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501

$1.140

$1.080

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AZTECH Wire

Italy . 962 parts In-Stock

1+ parts

$16.190

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962

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TANS Electronics

Latvia . 8,020 parts In-Stock

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SupplyDigital Components

Austria . 6,205 parts In-Stock

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Problanco Electronics

Mexico . 2,181 parts In-Stock

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UHIMA Technologies

Türkiye . 920 parts In-Stock

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Kulean Microsystems

USA . 731 parts In-Stock

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731

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Continental Prestige Electronics

USA . 382 parts In-Stock

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$0.831

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382

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$0.831

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Overview

Elevate your power management with the FDB9409L-F085 by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled performance for switching applications. With a maximum drain current of 90A and a low on-resistance of 0.0047 ohm, this N-channel transistor provides superior efficiency and reliability. Ideal for a wide range of industrial and automotive applications, the FDB9409L-F085 guarantees seamless operation and enhanced functionality. Choose Onsemi for cutting-edge technology that delivers exceptional value and unmatched quality. Experience the difference with the FDB9409L-F085 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have higher mobility and faster switching speeds compared to P-Channel FETs, making them suitable for efficient power control in electronic circuits.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET can handle higher voltage loads without compromising performance or safety.

Maximum Drain Current (Abs): 90 A

The high maximum drain current rating of 90A allows for efficient power handling and operation in high current applications.

Maximum Power Dissipation (Abs): 94 W

The high power dissipation rating of 94W ensures the FET can handle significant power levels without overheating, ensuring reliable operation.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C allows the FET to withstand high temperature environments, making it suitable for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) FDB9409L-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

33.7 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

90 A

Maximum Drain Current (ID):

90 A

Maximum Drain-Source On Resistance:

.0047 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

72 ns

Maximum Turn On Time (ton):

53 ns

Trade Compliance

FDB9409L-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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