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FDB9509L-F085

Onsemi

FDB9509L-F085 by Onsemi

FDB9509L-F085 by Onsemi is a P-CHANNEL Power FET with 40V DS Breakdown Voltage and 669A IDM. Ideal for applications requiring high power dissipation, it operates in Enhancement Mode with -55 to 175 °C temperature range.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,800 parts In-Stock

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8,800

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Digiode

USA . 1,446 parts In-Stock

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1,446

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Distributors (Availability)

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Native Components

USA . 52 parts In-Stock

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$1.165

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52

$1.165

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Northwest PG Solutions

USA . 403 parts In-Stock

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$1.282

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403

$1.282

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AZTECH Wire

Italy . 1,004 parts In-Stock

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$15.170

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$15.170

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Component Stockers USA

USA . 3,413 parts In-Stock

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$17.030

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3,413

$17.030

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QUARKTWIN TECHNOLOGY LTD

USA . 8,122 parts In-Stock

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Problanco Electronics

Mexico . 4,616 parts In-Stock

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Kulean Microsystems

USA . 2,224 parts In-Stock

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SupplyDigital Components

Austria . 1,466 parts In-Stock

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TANS Electronics

Latvia . 1,296 parts In-Stock

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Corphita

USA . 736 parts In-Stock

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736

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UHIMA Technologies

Türkiye . 654 parts In-Stock

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Corohmni

South Africa . 293 parts In-Stock

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Overview

Unleash the power of innovation with the FDB9509L-F085 by Onsemi. This high-quality P-CHANNEL Power FET offers unparalleled reliability and performance for a wide range of applications. With its built-in diode and enhancement mode operation, this transistor delivers exceptional efficiency and versatility. Whether you're working on automotive, industrial, or consumer electronics projects, this transistor is the perfect choice for your needs. Trust Onsemi to provide cutting-edge technology that exceeds expectations and empowers your designs to reach new heights of success. Choose the FDB9509L-F085 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the Power FET, making it reliable for long-term use.

Polarity or Channel Type: P-CHANNEL

The P-channel type allows for efficient control of power flow, contributing to energy savings and improved performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides reverse polarity protection, ensuring the safety and longevity of the connected circuitry.

Surface Mount: YES

The surface mount feature allows for easy and compact installation, making it suitable for space-constrained applications.

Minimum DS Breakdown Voltage: 40 V

The 40V breakdown voltage ensures that the Power FET can handle high voltage transients and surges, increasing the reliability of the circuit.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration into various electronic systems.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for precise and responsive control over the power flow, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 669 A

The high pulsed drain current rating of 669A ensures the Power FET can handle sudden peak loads without overheating or failing.

Avalanche Energy Rating (EAS): 82 mJ

The high avalanche energy rating of 82mJ indicates the Power FET's ability to withstand large energy spikes, ensuring reliability in demanding conditions.

Maximum Drain Current (Abs) (ID): 83 A

The maximum drain current rating of 83A allows for efficient power handling and improved overall performance of the circuit.

No. of Terminals: 2

The 2-terminal design simplifies installation and connection, reducing complexity and potential points of failure.

Maximum Power Dissipation (Abs): 93.8 W

The high power dissipation rating of 93.8W ensures the Power FET can handle and dissipate heat effectively, preventing overheating and damage.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for dense PCB layouts, making it suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers fast switching speeds and low on-resistance, translating to improved efficiency and performance.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C ensures the Power FET can operate reliably in high-temperature environments without degradation.

Transistor Element Material: SILICON

The use of silicon as the transistor element material provides high thermal conductivity and reliability, ensuring long-term performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C allows the Power FET to function effectively in extreme cold conditions, enhancing its versatility.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers good solderability and corrosion resistance, ensuring reliable connections and longevity.

Maximum Drain-Source On Resistance: 0.008 ohm

The low drain-source on-resistance of 0.008 ohm reduces power losses and improves efficiency, making the Power FET an ideal choice for high-performance applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection, reducing complexity and potential points of failure.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow duration of 30 seconds ensures proper soldering and reliability during assembly, contributing to the overall quality of the product.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245 °C allows for reliable and consistent soldering, ensuring solid connections and longevity.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 automotive qualification standard ensures the Power FET meets rigorous quality and reliability requirements for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) FDB9509L-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

82 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

83 A

Maximum Drain Current (ID):

83 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

669 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

FDB9509L-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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