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FDB9506L-F085

Onsemi

FDB9506L-F085 by Onsemi

Onsemi's FDB9506L-F085 is a P-CHANNEL Power FET with 40V DS Breakdown Voltage, 1260A IDM, and 0.0036 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

$1.750

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 3,200 parts In-Stock

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DigiKey

USA . 2,400 parts In-Stock

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$1.750

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2,400

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$1.750

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Rochester

USA . 941 parts In-Stock

1+ parts

-

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$1.560

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$1.390

10k+ parts

$1.310

941

-

$1.560

$1.390

$1.310

Verical

USA . 816 parts In-Stock

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$2.075

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$1.950

816

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$2.075

$1.950

Distributors (In-Stock)

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Vyrian

USA . 2,016 parts In-Stock

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$1.750

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2,016

$1.750

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Digiode

USA . 1,870 parts In-Stock

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$1.966

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$1.966

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Flip Electronics

USA . 3,200 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,054 parts In-Stock

1+ parts

$1.490

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$1.490

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Corohmni

South Africa . 70 parts In-Stock

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$1.750

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70

$1.750

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Corphita

USA . 1,823 parts In-Stock

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$1.863

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1,823

$1.863

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Native Components

USA . 302 parts In-Stock

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$11.105

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302

$11.105

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Northwest PG Solutions

USA . 2,086 parts In-Stock

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$12.215

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$10.994

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2,086

$12.215

$10.994

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QUARKTWIN TECHNOLOGY LTD

USA . 20,327 parts In-Stock

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TANS Electronics

Latvia . 6,210 parts In-Stock

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Problanco Electronics

Mexico . 3,274 parts In-Stock

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Perfect Parts

USA . 2,162 parts In-Stock

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SupplyDigital Components

Austria . 1,004 parts In-Stock

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Kulean Microsystems

USA . 471 parts In-Stock

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UHIMA Technologies

Türkiye . 23 parts In-Stock

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Overview

Unleash the power of innovation with Onsemi's FDB9506L-F085 Power Field Effect Transistor (FET). This P-CHANNEL transistor offers unparalleled quality and performance, making it ideal for a wide range of applications. With a single configuration and built-in diode, this transistor provides maximum efficiency and reliability. Whether you're looking to enhance your electronic devices or streamline your industrial processes, the FDB9506L-F085 delivers exceptional value and benefits that will take your projects to new heights. Trust Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability, making it a good choice for long-term usage.

Polarity or Channel Type: P-CHANNEL

P-channel FETs offer advantages such as lower ON-resistance and higher current handling capacity, making this product suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and helps in protecting the device from voltage spikes, enhancing the overall efficiency and reliability of the system.

Maximum Pulsed Drain Current (IDM): 1260 A

With a high pulsed drain current rating, this FET can handle sudden spikes in current without malfunctioning, making it ideal for applications requiring high power handling capabilities.

Maximum Power Dissipation (Abs): 176 W

The high power dissipation rating enables this FET to handle high levels of power without overheating, ensuring reliable performance even under heavy load conditions.

Maximum Operating Temperature: 175 °C

The wide operating temperature range allows this FET to be used in a variety of environments and applications, making it a versatile choice for different scenarios.

Maximum Drain-Source On Resistance: 0.0036 ohm

The low ON-resistance helps in reducing power losses and improving efficiency, making this FET suitable for high-frequency and high-efficiency applications.

Technical Specifications

Power Field Effect Transistors (FET) FDB9506L-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

370 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

110 A

Maximum Drain Current (ID):

110 A

Maximum Drain-Source On Resistance:

.0036 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

140 pF

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1260 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

FDB9506L-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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