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FDB9403-F085

Onsemi

FDB9403-F085 by Onsemi

FDB9403-F085 by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 110A, 0.0012 ohm Drain-Source Resistance, and 333W Power Dissipation. This ENHANCEMENT MODE transistor in GULL WING package operates up to 175 °C and meets AEC-Q101 standard.

Median Price

$5.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 13 parts In-Stock

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$5.320

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Flip Electronics (Authorized)

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Vyrian

USA . 1,199 parts In-Stock

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$3.600

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Flip Electronics

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Digiode

USA . 2,721 parts In-Stock

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Native Components

USA . 739 parts In-Stock

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$1.694

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Northwest PG Solutions

USA . 911 parts In-Stock

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$1.863

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Corohmni

South Africa . 392 parts In-Stock

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$3.600

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Component Stockers USA

USA . 61 parts In-Stock

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$4.300

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Ampacity Inc.

Singapore . 4,687 parts In-Stock

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$6.660

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Problanco Electronics

Mexico . 5,579 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

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SupplyDigital Components

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Kulean Microsystems

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TANS Electronics

Latvia . 2,672 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Perfect Parts

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Kepictronics

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UHIMA Technologies

Türkiye . 964 parts In-Stock

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Supply Digital

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Overview

Experience the superior quality and performance of Onsemi with the FDB9403-F085 Power Field Effect Transistor. Ideal for switching applications, this N-channel transistor offers a reliable single configuration with a built-in diode, ensuring efficient operation. With a maximum drain current of 110A and a low drain-source on resistance of 0.0012 ohm, this transistor provides exceptional power dissipation capabilities. Trust in Onsemi's expertise in semiconductor technology and elevate your projects with the FDB9403-F085.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the transistor durable and resistant to damage, ensuring reliable performance over time.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility and faster switching speeds, making this transistor suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for smooth and efficient switching operations, making this transistor ideal for switching applications where diode protection is required.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers excellent performance and reliability when used in various switching circuits.

Surface Mount: YES

Being surface mountable, this transistor is easy to install and saves space on the circuit board, making it ideal for compact electronics applications.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this transistor can handle higher voltages without breakdown, ensuring safe and reliable operation in high-voltage circuits.

Avalanche Energy Rating (EAS): 968 mJ

The high avalanche energy rating of 968 mJ indicates that this transistor can handle energy transients and surges without damage, ensuring increased reliability in harsh operating conditions.

Maximum Drain Current (ID): 110 A

With a high maximum drain current of 110A, this transistor can handle high current loads without overheating, making it suitable for power applications.

Maximum Power Dissipation (Abs): 333 W

The high power dissipation rating of 333W enables this transistor to handle high power levels without overheating, ensuring stable performance under heavy load conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures that the transistor can withstand the reflow soldering process, making it easy to integrate into manufacturing processes.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures that this transistor meets stringent automotive industry requirements, making it suitable for automotive applications where reliability is crucial.

Technical Specifications

Power Field Effect Transistors (FET) FDB9403-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

968 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

110 A

Maximum Drain Current (ID):

110 A

Maximum Drain-Source On Resistance:

.0012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDB9403-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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