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FCPF600N60ZL1

Onsemi

FCPF600N60ZL1 by Onsemi

FCPF600N60ZL1 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it features 22.2A IDM, 135mJ EAS, and 0.6 ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max temp of 150 °C and turn on/off times of 60ns/116ns.

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Vyrian

USA . 4,322 parts In-Stock

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Digiode

USA . 619 parts In-Stock

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AZTECH Wire

Italy . 59 parts In-Stock

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$13.200

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Native Components

USA . 952 parts In-Stock

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$198.064

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Northwest PG Solutions

USA . 1,824 parts In-Stock

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TANS Electronics

Latvia . 7,981 parts In-Stock

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Problanco Electronics

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Perfect Parts

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Kulean Microsystems

USA . 4,900 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 1,078 parts In-Stock

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Kepictronics

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Corphita

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UHIMA Technologies

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Overview

Unleash the power of innovation with the FCPF600N60ZL1 by Onsemi, a top-of-the-line Power Field Effect Transistor that sets new standards in performance and reliability. Manufactured by industry leader Onsemi, this N-CHANNEL transistor is a game-changer in switching applications, offering unparalleled efficiency and durability. With a high breakdown voltage of 600V and a maximum pulsing drain current of 22.2A, this transistor delivers exceptional power while maintaining a compact design. Say goodbye to downtime and hello to seamless operations with the FCPF600N60ZL1 – the ultimate choice for professionals seeking quality, value, and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties, making the product more reliable and durable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher mobility and conductivity, leading to better performance in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Maximum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown or damage.

Avalanche Energy Rating (EAS): 135 mJ

The high avalanche energy rating allows the FET to withstand sudden voltage spikes or transients.

Maximum Power Dissipation (Abs): 28 W

With a high power dissipation rating, this FET can handle higher power loads without overheating.

Maximum Operating Temperature: 150 °C

Can operate at higher temperatures without reliability issues, suitable for various environments.

Maximum Turn Off Time (toff): 116 ns

Fast turn-off time ensures efficient switching operations and reduces power wastage.

Technical Specifications

Power Field Effect Transistors (FET) FCPF600N60ZL1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

135 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

7.4 A

Maximum Drain Current (ID):

7.4 A

Maximum Drain-Source On Resistance:

.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

45 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

22.2 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

116 ns

Maximum Turn On Time (ton):

60 ns

Trade Compliance

FCPF600N60ZL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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