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FCH041N65EFL4

Onsemi

FCH041N65EFL4 by Onsemi

FCH041N65EFL4 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 228A and EAS of 2025mJ, making it suitable for high-power operations. With an operating temperature range from -55 to 150 °C, this MOSFET offers fast ton of 180ns and toff of 394ns for efficient performance.

Median Price

$10.005

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 4 parts In-Stock

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$7.870

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4

$7.870

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Chip1Stop

Japan . 4 parts In-Stock

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$9.310

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4

$9.310

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Mouser Electronics

USA . 417 parts In-Stock

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$14.830

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417

$14.830

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DigiKey

USA . 417 parts In-Stock

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$17.090

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$10.588

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$9.232

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417

$17.090

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$9.232

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Rochester

USA . 232 parts In-Stock

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$9.240

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$8.270

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$7.780

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$7.780

Farnell

UK . 232 parts In-Stock

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$10.005

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Verical

USA . 232 parts In-Stock

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$11.550

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$10.338

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$9.725

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$10.338

$9.725

Distributors (In-Stock)

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Digiode

USA . 911 parts In-Stock

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$7.760

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911

$7.760

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Nova Conductors

Japan . 150 parts In-Stock

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$9.452

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$9.452

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Chip Stock

USA . 50,000 parts In-Stock

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Flip Electronics

USA . 634 parts In-Stock

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DigiKey Marketplace

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Vyrian

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$0.421

100+ parts

$0.383

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$0.345

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$0.421

$0.383

$0.345

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Aztec Data Supply Inc.

USA . 3,108 parts In-Stock

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$1.228

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$1.228

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Semicontronic

India . 193 parts In-Stock

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$6.940

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$6.766

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$6.732

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$6.940

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$6.732

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Ampacity Inc.

Singapore . 99 parts In-Stock

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$6.940

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Corphita

USA . 1,553 parts In-Stock

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$7.351

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Corohmni

South Africa . 149 parts In-Stock

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$8.168

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Aranea Global

USA . 500 parts In-Stock

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$9.263

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$8.893

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$9.263

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$8.893

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Microchip USA

USA . 6,415 parts In-Stock

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$43.848

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QUARKTWIN TECHNOLOGY LTD

USA . 22,049 parts In-Stock

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Lixinc

USA . 9,373 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 5,768 parts In-Stock

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Perfect Parts

USA . 4,798 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,845 parts In-Stock

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Argo Parts USA

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Kulean Microsystems

USA . 3,155 parts In-Stock

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TANS Electronics

Latvia . 2,615 parts In-Stock

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Supply Digital

USA . 2,607 parts In-Stock

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Problanco Electronics

Mexico . 2,575 parts In-Stock

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SupplyDigital Components

Austria . 2,302 parts In-Stock

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RC Electronics

USA . 590 parts In-Stock

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$7.960

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$7.510

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$7.360

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$7.360

UHIMA Technologies

Türkiye . 474 parts In-Stock

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Continental Prestige Electronics

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Overview

Power up your applications with the FCH041N65EFL4 by Onsemi. This high-quality Power Field Effect Transistor (FET) offers unparalleled performance and reliability, making it the ideal choice for a wide range of switching applications. With its N-CHANNEL polarity, SINGLE configuration with built-in diode, and impressive 650V minimum DS breakdown voltage, this transistor ensures efficient operation and enhanced durability. Trust Onsemi's expertise in semiconductor technology to deliver a product that exceeds expectations. Elevate your projects with the FCH041N65EFL4 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in power applications due to their ability to handle higher voltages and currents compared to P-channel FETs.

Minimum DS Breakdown Voltage: 650 V

With a minimum breakdown voltage of 650V, this FET can handle high voltage applications with ease.

Maximum Power Dissipation (Abs): 595 W

The high power dissipation rating of 595W allows this FET to handle high power applications without overheating.

Maximum Drain-Source On Resistance: 0.041 ohm

The low on-resistance of 0.041 ohm results in lower power dissipation and higher efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FCH041N65EFL4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

2025 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

76 A

Maximum Drain Current (ID):

76 A

Maximum Drain-Source On Resistance:

.041 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

35 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

228 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

394 ns

Maximum Turn On Time (ton):

180 ns

Trade Compliance

FCH041N65EFL4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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