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FCH023N65S3-F155

Onsemi

FCH023N65S3-F155 by Onsemi

FCH023N65S3-F155 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. It has a max IDM of 300A and EAS of 2025mJ, suitable for SWITCHING applications. With a Drain Current of 75A and 0.023 ohm RDS(on), it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150 °C.

Median Price

$15.115

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 1,060 parts In-Stock

1+ parts

$14.300

100+ parts

$8.725

1k+ parts

$7.337

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1,060

$14.300

$8.725

$7.337

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Mouser Electronics

USA . 905 parts In-Stock

1+ parts

$14.300

100+ parts

$8.500

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905

$14.300

$8.500

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Rochester

USA . 248 parts In-Stock

1+ parts

$15.930

100+ parts

$14.980

1k+ parts

$13.540

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248

$15.930

$14.980

$13.540

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Newark

USA . 375 parts In-Stock

1+ parts

$17.510

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$11.600

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375

$17.510

$11.600

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Chip1Stop

Japan . 68 parts In-Stock

1+ parts

$20.840

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$14.900

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68

$20.840

$14.900

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Element14

Singapore . 408 parts In-Stock

1+ parts

$22.558

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$17.531

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$15.481

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408

$22.558

$17.531

$15.481

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Arrow

USA . 248 parts In-Stock

1+ parts

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$8.692

1k+ parts

$7.457

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248

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$8.692

$7.457

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Verical

USA . 240 parts In-Stock

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$8.692

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$7.457

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$8.692

$7.457

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Distributors (In-Stock)

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Bristol Electronics

USA . 24 parts In-Stock

1+ parts

$12.000

100+ parts

$7.500

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-

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24

$12.000

$7.500

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Digiode

USA . 3,274 parts In-Stock

1+ parts

$15.134

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$15.134

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Nova Conductors

Japan . 60 parts In-Stock

1+ parts

$17.689

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$17.689

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Chip Stock

USA . 18,500 parts In-Stock

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18,500

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IBS Electronics

USA . 8,550 parts In-Stock

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$10.505

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$10.982

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8,550

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$10.505

$10.982

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Vyrian

USA . 1,164 parts In-Stock

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NAC Semi

USA . 900 parts In-Stock

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$15.660

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900

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$15.660

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Flip Electronics

USA . 100 parts In-Stock

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Martec Srl

Italy . 81 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,039 parts In-Stock

1+ parts

$0.600

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2,039

$0.600

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Semicontronic

India . 2,121 parts In-Stock

1+ parts

$12.990

100+ parts

$12.665

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$12.600

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2,121

$12.990

$12.665

$12.600

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Ampacity Inc.

Singapore . 2,037 parts In-Stock

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$12.990

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2,037

$12.990

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Corphita

USA . 228 parts In-Stock

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$14.337

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$14.337

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Corohmni

South Africa . 117 parts In-Stock

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$15.930

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$15.930

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Continental Prestige Electronics

USA . 9,581 parts In-Stock

1+ parts

$16.791

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$16.455

9,581

$16.791

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$16.455

Aranea Global

USA . 100 parts In-Stock

1+ parts

$17.335

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$16.642

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100

$17.335

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$17.689

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$16.805

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$16.451

2,000

$17.689

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$16.805

$16.451

Microchip USA

USA . 307 parts In-Stock

1+ parts

$48.990

100+ parts

$48.140

1k+ parts

$47.710

10k+ parts

$47.290

307

$48.990

$48.140

$47.710

$47.290

Robosynatics

Brazil . 21,387 parts In-Stock

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Argo Parts USA

USA . 9,604 parts In-Stock

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Advanced Electronics

New Zealand . 6,982 parts In-Stock

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Lixinc

USA . 4,433 parts In-Stock

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Perfect Parts

USA . 3,549 parts In-Stock

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RC Electronics

USA . 3,497 parts In-Stock

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TANS Electronics

Latvia . 3,309 parts In-Stock

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SupplyDigital Components

Austria . 2,165 parts In-Stock

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Kulean Microsystems

USA . 1,861 parts In-Stock

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Problanco Electronics

Mexico . 1,816 parts In-Stock

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Supply Digital

USA . 1,209 parts In-Stock

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UHIMA Technologies

Türkiye . 403 parts In-Stock

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iodParts Technologies Inc.

India . 350 parts In-Stock

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GreenTree Electronics

Israel . 90 parts In-Stock

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Overview

Discover the FCH023N65S3-F155 by Onsemi, a high-quality Power Field Effect Transistor (FET) that promises reliability and efficiency. With Onsemi's reputation for excellence in semiconductor manufacturing, this N-CHANNEL transistor with a built-in diode is ideal for switching applications. Offering a minimum DS Breakdown Voltage of 650V and a maximum Drain Current of 75A, this transistor ensures optimal performance even in challenging environments. Trust Onsemi to deliver cutting-edge technology and unmatched value with the FCH023N65S3-F155.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good insulation and protection for the internal components of the FET, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs have lower ON resistance compared to P-channel FETs, offering better efficiency and performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient response when turning on and off.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle higher voltages, providing increased safety and reliability in high-power applications.

Maximum Pulsed Drain Current (IDM): 300 A

Capable of handling high current pulses, making it suitable for applications that require high power output in short durations.

Maximum Power Dissipation (Abs): 595 W

With high power dissipation capability, this FET can effectively handle heat generated during operation, ensuring long-term reliability.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for applications where thermal management is critical.

Technical Specifications

Power Field Effect Transistors (FET) FCH023N65S3-F155 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

2025 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

300 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCH023N65S3-F155 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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