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FCH072N60

Onsemi

FCH072N60 by Onsemi

FCH072N60 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a max IDM of 156A and 0.072 ohm RDS(on). With a package style of FLANGE MOUNT, it operates in ENHANCEMENT MODE up to 150°C.

Median Price

$10.580

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 300 parts In-Stock

1+ parts

$10.580

100+ parts

-

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$5.740

10k+ parts

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300

$10.580

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$5.740

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DigiKey

USA . 217 parts In-Stock

1+ parts

$10.580

100+ parts

$6.287

1k+ parts

$4.953

10k+ parts

-

217

$10.580

$6.287

$4.953

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Chip1Stop

Japan . 3,269 parts In-Stock

1+ parts

$32.300

100+ parts

$13.400

1k+ parts

$8.180

10k+ parts

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3,269

$32.300

$13.400

$8.180

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Flip Electronics (Authorized)

USA . 2,142 parts In-Stock

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2,142

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Rochester

USA . 818 parts In-Stock

1+ parts

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$4.950

1k+ parts

$4.430

10k+ parts

$4.170

818

-

$4.950

$4.430

$4.170

Verical

USA . 450 parts In-Stock

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$4.746

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450

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$4.746

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Distributors (In-Stock)

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Digiode

USA . 538 parts In-Stock

1+ parts

$4.978

100+ parts

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538

$4.978

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$5.454

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50

$5.454

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Chip Stock

USA . 65,000 parts In-Stock

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65,000

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Flip Electronics

USA . 2,142 parts In-Stock

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2,142

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Vyrian

USA . 1,095 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,096 parts In-Stock

1+ parts

$0.820

100+ parts

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2,096

$0.820

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Semicontronic

India . 1,450 parts In-Stock

1+ parts

$4.450

100+ parts

$4.339

1k+ parts

$4.316

10k+ parts

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1,450

$4.450

$4.339

$4.316

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Ampacity Inc.

Singapore . 1,059 parts In-Stock

1+ parts

$4.450

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1,059

$4.450

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Corphita

USA . 1,788 parts In-Stock

1+ parts

$4.716

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1,788

$4.716

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Corohmni

South Africa . 103 parts In-Stock

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$5.240

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103

$5.240

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Continental Prestige Electronics

USA . 1,008 parts In-Stock

1+ parts

$5.454

100+ parts

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$5.345

1,008

$5.454

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$5.345

Microchip USA

USA . 7,184 parts In-Stock

1+ parts

$26.656

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7,184

$26.656

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Perfect Parts

USA . 22,072 parts In-Stock

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22,072

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Lixinc

USA . 16,023 parts In-Stock

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GreenTree Electronics

Israel . 3,369 parts In-Stock

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3,369

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SupplyDigital Components

Austria . 2,652 parts In-Stock

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Argo Parts USA

USA . 2,105 parts In-Stock

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Supply Digital

USA . 1,701 parts In-Stock

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TANS Electronics

Latvia . 1,463 parts In-Stock

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Kulean Microsystems

USA . 1,235 parts In-Stock

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Problanco Electronics

Mexico . 1,031 parts In-Stock

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UHIMA Technologies

Türkiye . 573 parts In-Stock

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S.R.D Solutions

India . 500 parts In-Stock

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500

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Overview

Discover the ultimate power solution with the FCH072N60 by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in switching applications. With a high DS Breakdown Voltage of 600V and a maximum Drain Current of 52A, this transistor is designed to handle your power needs with ease. Whether you're looking to enhance your system efficiency or boost performance, the FCH072N60 delivers the value and reliability you can trust. Upgrade to Onsemi and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, ideal for various applications.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage ensures that the transistor can withstand high voltage applications without getting damaged.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it efficient and reliable for controlling power circuits.

Maximum Pulsed Drain Current (IDM): 156 A

The high pulsed drain current rating allows for handling of high current spikes, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 481 W

The high power dissipation capability ensures that the transistor can handle high power levels efficiently without overheating.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, the transistor can operate in high-temperature environments without any issues.

Technical Specifications

Power Field Effect Transistors (FET) FCH072N60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1128 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

52 A

Maximum Drain Current (ID):

52 A

Maximum Drain-Source On Resistance:

.072 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

156 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCH072N60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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