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FCH041N60F

Onsemi

FCH041N60F by Onsemi

FCH041N60F by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It has a max IDM of 228A and EAS of 2025mJ, ideal for SWITCHING applications. This ENHANCEMENT MODE transistor features 0.041 ohm RDS(on) and can handle up to 76A drain current, making it suitable for high-power operations at temperatures up to 150°C.

Median Price

$12.585

Lifecycle Status

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14

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1k+

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DigiKey

USA . 279 parts In-Stock

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$11.390

100+ parts

$6.816

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$5.459

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279

$11.390

$6.816

$5.459

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Mouser Electronics

USA . 121 parts In-Stock

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$11.390

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$6.240

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121

$11.390

$6.240

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Newark

USA . 1,273 parts In-Stock

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$13.780

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$8.630

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$13.780

$8.630

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Element14

Singapore . 1,274 parts In-Stock

1+ parts

$16.480

100+ parts

$9.030

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$8.850

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1,274

$16.480

$9.030

$8.850

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Chip1Stop

Japan . 20 parts In-Stock

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$34.400

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$34.400

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Verical

USA . 24,300 parts In-Stock

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$5.494

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$5.494

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Distributors (In-Stock)

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Digiode

USA . 1,798 parts In-Stock

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$9.949

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1,798

$9.949

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Schukat

Germany . 468 parts In-Stock

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$17.587

100+ parts

$10.073

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468

$17.587

$10.073

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Chip Stock

USA . 6,000 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Vyrian

USA . 578 parts In-Stock

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578

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NAC Semi

USA . 300 parts In-Stock

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300

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$8.030

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ComSIT Distribution GmbH

Germany . 11 parts In-Stock

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NexGen Digital

USA . 4 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 890 parts In-Stock

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$1.210

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890

$1.210

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$1.782

100+ parts

$1.622

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$1.461

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3,000

$1.782

$1.622

$1.461

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Corohmni

South Africa . 360 parts In-Stock

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$7.077

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360

$7.077

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Ampacity Inc.

Singapore . 585 parts In-Stock

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$8.900

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585

$8.900

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Semicontronic

India . 582 parts In-Stock

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$8.900

100+ parts

$8.678

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$8.633

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582

$8.900

$8.678

$8.633

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Corphita

USA . 3,063 parts In-Stock

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$9.426

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3,063

$9.426

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Microchip USA

USA . 5,550 parts In-Stock

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$37.184

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Lixinc

USA . 15,987 parts In-Stock

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Perfect Parts

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RC Electronics

USA . 8,895 parts In-Stock

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$7.710

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$7.040

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$6.830

8,895

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$7.040

$6.830

Kepictronics

USA . 6,513 parts In-Stock

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TANS Electronics

Latvia . 4,986 parts In-Stock

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SupplyDigital Components

Austria . 3,930 parts In-Stock

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Kulean Microsystems

USA . 3,342 parts In-Stock

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S.R.D Solutions

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A-Z Elektronik GmbH

Germany . 1,974 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Supply Digital

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Alle Elektronik GmbH

Germany . 1,316 parts In-Stock

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Problanco Electronics

Mexico . 1,307 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Eastek

USA . 90 parts In-Stock

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UHIMA Technologies

Türkiye . 89 parts In-Stock

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Overview

Power up your applications with the FCH041N60F by Onsemi, a high-quality N-channel power field effect transistor designed for switching applications. Manufactured by Onsemi, known for their superior technology and reliability, this transistor offers a maximum pulsed drain current of 228A and a minimum DS breakdown voltage of 600V. With a single configuration and built-in diode, this transistor provides enhanced performance and efficiency. Ideal for a wide range of power applications, this transistor delivers exceptional value, benefits, and advantages to customers seeking reliable and durable solutions. Elevate your projects with the FCH041N60F and experience the difference in performance and quality that Onsemi is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and reliable, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low losses, making it ideal for power management tasks.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage of 600V, this FET can handle high voltage applications with ease, providing a robust solution for power electronics.

Maximum Pulsed Drain Current (IDM): 228 A

The high maximum pulsed drain current capability of 228A allows this FET to handle large current spikes, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 595 W

The high power dissipation rating of 595W ensures that this FET can handle high power levels efficiently without overheating, making it a reliable choice for demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) FCH041N60F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

2025 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

76 A

Maximum Drain Current (ID):

76 A

Maximum Drain-Source On Resistance:

.041 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

228 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCH041N60F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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