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CAT8900A180TBIT3

Onsemi

CAT8900A180TBIT3 by Onsemi

CAT8900A180TBIT3 by Onsemi is a 3-terminal voltage reference with Vsup range of 2.7-5.5V, output voltage of 1.7995-1.8005V, and temp coef of 20 ppm/°C. Ideal for industrial applications requiring precise voltage regulation in compact spaces due to its small outline, low profile package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,359 parts In-Stock

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1,359

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Digiode

USA . 106 parts In-Stock

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106

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Native Components

USA . 169 parts In-Stock

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$11.359

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169

$11.359

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Northwest PG Solutions

USA . 1,147 parts In-Stock

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$12.494

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$11.245

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1,147

$12.494

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SupplyDigital Components

Austria . 8,024 parts In-Stock

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Kulean Microsystems

USA . 6,033 parts In-Stock

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6,033

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TANS Electronics

Latvia . 3,827 parts In-Stock

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Corphita

USA . 1,382 parts In-Stock

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UHIMA Technologies

Türkiye . 529 parts In-Stock

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Problanco Electronics

Mexico . 279 parts In-Stock

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Corohmni

South Africa . 169 parts In-Stock

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Overview

Elevate your electronic designs with the premium quality CAT8900A180TBIT3 voltage reference by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch performance and reliability in all their products. This voltage reference is perfect for a wide range of applications, offering precise output voltage and stable operation even in harsh industrial environments. Experience the value of accurate voltage regulation and trust in the advantages that Onsemi brings to every electronic project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the device lightweight and durable, perfect for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and enhancing reliability.

Nominal Supply Voltage (Vsup): 3 V

The 3V nominal supply voltage is a common standard in many electronic systems, providing compatibility and ease of integration.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this voltage reference can withstand high temperature environments, ensuring reliable performance under varying conditions.

Minimum Output Voltage: 1.7995 V

The precise minimum output voltage of 1.7995 V ensures accuracy and stability in voltage regulation, crucial for sensitive electronic components.

Max Voltage Temp Coef: 20 ppm/°C

The low temperature coefficient of 20 ppm/°C ensures minimal voltage variation with temperature changes, maintaining precision in voltage references.

Nominal Output Voltage: 1.8 V

The 1.8V nominal output voltage provides a stable reference voltage for circuits requiring a specific voltage level, aiding in accurate signal processing.

Technical Specifications

Voltage References CAT8900A180TBIT3 attributes and parameters. Explore more Voltage References devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G3

Length:

2.92 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

1.8005 V

Minimum Output Voltage:

1.7995 V

Nominal Output Voltage:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Max Voltage Temp Coef:

20 ppm/Cel

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trim or Adjustable Output (V):

NO

Width (mm):

1.3 mm

Trade Compliance

CAT8900A180TBIT3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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