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CAT8900A204TBIT3

Onsemi

CAT8900A204TBIT3 by Onsemi

CAT8900A204TBIT3 by Onsemi is a 3-terminal voltage reference with Vsup of 2.7-5.5V, output voltage range of 2.0475-2.0485V, and temp coef of 20 ppm/°C. Ideal for industrial applications requiring precise voltage regulation in compact spaces due to its small outline, low profile package design.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 2,154 parts In-Stock

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Vyrian

USA . 1,035 parts In-Stock

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SupplyDigital Components

Austria . 3,604 parts In-Stock

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Kulean Microsystems

USA . 2,764 parts In-Stock

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Problanco Electronics

Mexico . 2,596 parts In-Stock

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TANS Electronics

Latvia . 2,480 parts In-Stock

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Northwest PG Solutions

USA . 1,321 parts In-Stock

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Corphita

USA . 1,022 parts In-Stock

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UHIMA Technologies

Türkiye . 498 parts In-Stock

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Native Components

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Corohmni

South Africa . 163 parts In-Stock

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Overview

Elevate your electronic designs with the CAT8900A204TBIT3 voltage reference by Onsemi. Made from high-quality materials, this small outline, low profile package offers precise output voltage stability for industrial applications. Onsemi's reputation for reliability ensures consistent performance, while the compact design and wide temperature range make it ideal for a variety of projects. Say goodbye to fluctuations and hello to dependable voltage regulation with the CAT8900A204TBIT3. Upgrade your circuits today and experience the difference Onsemi delivers.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount YES

Surface mount capability allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage (Vsup) 3 V

Designed to operate effectively with a 3V power supply, making it compatible with many applications.

Minimum Output Voltage 2.0475 V

Provides a precise minimum output voltage for consistent performance.

Maximum Output Voltage 2.0485 V

Offers a tight range for maximum output voltage, ensuring stability in operation.

Maximum Operating Temperature 85 °C

Capable of operating at high temperatures, ideal for industrial environments.

Minimum Operating Temperature -40 °C

Can withstand low temperatures, suitable for use in a variety of climates.

Maximum Seated Height 1.22 mm

Low profile design enables compact integration into electronic devices.

Width (mm) 1.3 mm

Narrow width allows for efficient use of space on PCBs.

Other IC type THREE TERMINAL VOLTAGE REFERENCE

Three terminal design provides stable voltage references for accurate circuits.

Minimum Supply Voltage (Vsup) 2.7 V

Can operate at lower supply voltages, increasing flexibility in design.

Temperature Grade INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh conditions.

Terminal Form GULL WING

Gull wing terminals offer secure connections during installation.

Max Voltage Temp Coef 20 ppm/°C

Low voltage temperature coefficient ensures stable output voltage over a wide temperature range.

Maximum Supply Voltage (Vsup) 5.5 V

Can handle higher supply voltages, suitable for a range of applications.

Nominal Output Voltage 2.048 V

Precise nominal output voltage for accurate voltage reference in circuits.

Technical Specifications

Voltage References CAT8900A204TBIT3 attributes and parameters. Explore more Voltage References devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G3

Length:

2.92 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

2.0485 V

Minimum Output Voltage:

2.0475 V

Nominal Output Voltage:

2.048 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Max Voltage Temp Coef:

20 ppm/Cel

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trim or Adjustable Output (V):

NO

Width (mm):

1.3 mm

Trade Compliance

CAT8900A204TBIT3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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