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BF244BRLRP

Onsemi

BF244BRLRP by Onsemi

BF244BRLRP by Onsemi is an N-CHANNEL RF FET with 30V DS Breakdown Voltage. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it features DEPLETION MODE operation and 0.1A ID. Package: PLASTIC/EPOXY, Shape: ROUND, Terminals: 3.

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2

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1k+

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Digiode

USA . 880 parts In-Stock

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Vyrian

USA . 129 parts In-Stock

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Native Components

USA . 814 parts In-Stock

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$1.802

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Northwest PG Solutions

USA . 1,633 parts In-Stock

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TANS Electronics

Latvia . 8,186 parts In-Stock

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Kulean Microsystems

USA . 5,825 parts In-Stock

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Problanco Electronics

Mexico . 5,654 parts In-Stock

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SupplyDigital Components

Austria . 4,601 parts In-Stock

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UHIMA Technologies

Türkiye . 849 parts In-Stock

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Corphita

USA . 547 parts In-Stock

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Corohmni

South Africa . 64 parts In-Stock

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Overview

Enhance your amplifier projects with the BF244BRLRP RF Small Signal Field Effect Transistor by Onsemi. Known for their high-quality products, Onsemi delivers reliable performance and durability. Ideal for ultra-high frequency applications, this N-CHANNEL transistor offers a minimum DS breakdown voltage of 30V. With a single configuration and through-hole terminal form, this transistor is perfect for various amplifier applications. Trust Onsemi to provide you with the value and benefits you need for your projects. Choose the BF244BRLRP for superior performance and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, ensuring a longer lifespan and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility and faster switching speeds, making them suitable for amplifier applications where improved performance is desired.

Configuration: SINGLE

Single configuration simplifies the design and integration process, making it easier to use in amplifier circuits without the need for complex circuit arrangements.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance and efficiency in signal amplification tasks.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this transistor can handle higher voltages in amplifier circuits, providing protection against voltage spikes and ensuring reliable operation.

Package Shape: ROUND

The round package shape allows for easy mounting and placement in circuit boards, making it suitable for various amplifier designs and configurations.

Terminal Form: THROUGH-HOLE

Through-hole terminals enable secure connections and easy soldering onto circuit boards, providing a stable and reliable electrical connection for amplifier applications.

Operating Mode: DEPLETION MODE

Depletion mode operation offers better control over the transistor's conductivity, allowing for precise adjustment of amplification levels in amplifier circuits.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, this transistor can deliver fast response times and high-speed performance in amplifier circuits operating at high frequencies.

No. of Terminals: 3

The three terminals provide the necessary connections for amplification tasks and enable easy integration into amplifier circuit designs.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers a compact and space-saving design, making it ideal for applications where size constraints are important, such as in portable amplifier devices.

Field Effect Transistor Technology: JUNCTION

Junction technology in the field-effect transistor design provides high efficiency and low power consumption, making it suitable for amplifier applications requiring energy-efficient operation.

Transistor Element Material: SILICON

Silicon material ensures high performance and reliability in amplifier circuits, offering excellent thermal stability and electrical properties for optimal signal amplification.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers strong solder connections and corrosion resistance, ensuring long-term reliability and stable performance in amplifier applications.

Maximum Drain Current (ID): 0.1 A

With a maximum drain current of 0.1 A, this transistor can handle moderate power levels in amplifier circuits, providing sufficient amplification capability for various signal processing tasks.

Terminal Position: BOTTOM

Bottom terminal position allows for easy mounting and soldering onto circuit boards, ensuring secure connections and reliable operation in amplifier applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF244BRLRP attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF244BRLRP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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