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AMIS30623C6239G

Onsemi

AMIS30623C6239G by Onsemi

AMIS30623C6239G by Onsemi is a Motion Control IC with 20 terminals, operating voltage of 6.5-29V, and max output current of 0.8A. Ideal for automotive applications due to its small outline package and temp range of -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,324 parts In-Stock

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Digiode

USA . 1,334 parts In-Stock

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AZTECH Wire

Italy . 1,022 parts In-Stock

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$15.440

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Native Components

USA . 50 parts In-Stock

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$95.261

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$91.450

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$91.450

Component Stockers USA

USA . 351 parts In-Stock

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$99.990

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Northwest PG Solutions

USA . 1,613 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,439 parts In-Stock

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Kulean Microsystems

USA . 6,631 parts In-Stock

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TANS Electronics

Latvia . 4,740 parts In-Stock

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Microchip USA

USA . 4,729 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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UHIMA Technologies

Türkiye . 349 parts In-Stock

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SupplyDigital Components

Austria . 156 parts In-Stock

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Problanco Electronics

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Corohmni

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Overview

Discover the seamless integration of cutting-edge technology and reliable performance with the AMIS30623C6239G by Onsemi. As a leader in motion control ICs, Onsemi delivers top-notch quality and innovation in every product. Ideal for automotive applications, this stepper motor controller offers unparalleled precision and efficiency. Experience the value of smooth operation and optimal functionality, making it the perfect choice for your next project. Elevate your designs with Onsemi's AMIS30623C6239G and unlock a world of possibilities in motion control technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable makes it easy to integrate into PCBs, saving space and simplifying the overall design.

Nominal Supply Voltage (Vsup): 8 V

The nominal supply voltage of 8V ensures compatibility with a standard power source, making it easy to incorporate into various systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand high-temperature environments, enhancing its reliability.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C ensures that the product can function in cold environments without any issues.

Maximum Output Current: 0.8 A

The high maximum output current of 0.8A allows the product to drive stepper motors effectively, making it suitable for motion control applications.

Technical Specifications

Motion Control ICs AMIS30623C6239G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO NEEDS 4.75V TO 5.5V VDD SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.7762 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,6.5/29

Qualification:

Not Qualified

Maximum Seated Height:

2.6416 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

6.5 V

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

AMIS30623C6239G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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